Research Papers

Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

[+] Author and Article Information
Yu-Tang Yen

Department of Engineering Science, National Cheng Kung University, Tainan 701, Taiwan

Te-Hua Fang

Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 80778, Taiwan

Yu-Cheng Lin1

Department of Engineering Science, National Cheng Kung University, Tainan, Taiwanyuclin@mail.ncku.edu.tw


Corresponding author.

J. Electron. Packag 132(4), 041005 (Nov 24, 2010) (5 pages) doi:10.1115/1.4002723 History: Received March 18, 2010; Revised August 02, 2010; Published November 24, 2010; Online November 24, 2010

This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried out by utilizing a combination of process parameters based on a two-level L12 Taguchi orthogonal design. The signal-to-noise and the analysis of variance are used to find the optimum levels and to indicate the impact of the process parameters on warpage. The results show that the method can reduce warpage by about 94%, and a verification test is also conducted to prove its effectiveness after the optimum levels of process parameters are determined. It can thus be concluded that this Taguchi method is suitable to solve the quality problems that occur due to warpage.

Copyright © 2010 by American Society of Mechanical Engineers
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Figure 1

Design geometries of the bonding sheet. The coating roller is used to coat adhesive on the polyethylene terephthalate and then laminate a release paper on the adhesive.

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Figure 2

Schematic of manufacturing procedure. (a) PET film. (b) The coating roller is used to coat adhesive on the PET film. The upper roller is main pressure roller, and the bottom roller is main heating roller. (c) The PET and adhesive film goes through the preheating oven. This oven has first, second, and third preheating bars. (d) The release paper is laminated on the adhesive.

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Figure 3

Plots of process parameters effects for warpage index with a bonding sheet

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Figure 4

Before and after the process. (a) With the conditions for general process parameters, warpage is equal to 5 cm. (b) After applying optimization from the Taguchi method to produce the bonding sheet, warpage is equal to 0.3 cm.




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