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Research Papers

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

[+] Author and Article Information
K. N. Prabhu1

Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka Surathkal, Srinivasnagar, 575025 Karnataka, Indiaprabhukn_2002@yahoo.co.in

G. Kumar

Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka Surathkal, Srinivasnagar, 575025 Karnataka, India

1

Corresponding author.

J. Electron. Packag 132(4), 041001 (Nov 19, 2010) (7 pages) doi:10.1115/1.4002899 History: Received February 01, 2010; Revised October 03, 2010; Published November 19, 2010; Online November 19, 2010

The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn–37Pb, Sn–3.5Ag, and Sn–9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented by the exponential power law (EPL): ϕ=exp(Kτn). The EPL parameter K has the significance of accelerating the kinetics of relaxation while the parameter n represents the resistance to spreading process (spread resistance parameter). EPL parameters exhibited a decreasing trend with an increase in surface roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems.

Copyright © 2010 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Schematic sketch of experimental setup

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Figure 2

Photographic images of spreading of the Sn–37Pb solder on smooth copper substrates

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Figure 3

Photographic images of spreading of the Sn–9Zn solder on smooth copper substrates

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Figure 4

Photographic images of spreading of the Sn–3.5Ag solder on smooth copper substrates

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Figure 5

Typical ln (D) versus ln (t) plot

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Figure 17

Arrhenius plot for the spreading of the Sn–9Zn solder

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Figure 16

Arrhenius plot for the spreading of the Sn–3.5Ag solder

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Figure 15

Arrhenius plot for the spreading of the Sn–37Pb solder

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Figure 14

Effect of temperature on the relaxation time during solder spreading

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Figure 13

Effect of operating temperature on the equilibrium contact angle of solders

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Figure 12

Variation of EPL parameters with surface roughness for the spreading of the Sn–37Pb solder

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Figure 11

Relaxation time as a function of percent contact angle relaxation for the Sn–37Pb solder on brass substrate

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Figure 10

Relaxation time as a function of percent contact angle relaxation for the Sn–37Pb solder on copper substrate

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Figure 9

Contact angle as a function of surface roughness for the spreading of solders on copper substrates

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Figure 8

Dimensional contact angle versus dimensionless time for varying values of n

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Figure 7

Dimensional contact angle versus dimensionless time for varying values of K

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