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Research Papers

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

[+] Author and Article Information
Xin Li

School of Material Science and Engineering, Tianjin University, Tianjin, 300072, P.R. China; Tianjin Key Laboratory of Advanced Joining Technology, Tianjin, 300072, P.R. China

Xu Chen1

School of Chemical Engineering and Technology, Tianjin University, Tianjin, 300072, P.R. China; Tianjin Key Laboratory of Advanced Joining Technology, Tianjin, 300072, P.R. Chinaxchen@tju.edu.cn

Guo-Quan Lu

Department of Material Science and Engineering, Virginia Polytechnic Institute and State University, 213 Holden Hall, M/C 0237, Blacksburg, VA 24061; School of Material Science and Engineering, Tianjin University, Tianjin, 300072, P.R. China

1

Corresponding author.

J. Electron. Packag 132(3), 031011 (Sep 30, 2010) (5 pages) doi:10.1115/1.4002299 History: Received November 16, 2009; Revised July 06, 2010; Published September 30, 2010; Online September 30, 2010

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

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Copyright © 2010 by American Society of Mechanical Engineers
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Figures

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Figure 1

Low temperature sintering processing for nanosilver paste

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Figure 2

Wire bonded LED module

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Figure 3

Sketch of shear testing

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Figure 4

The temperature profile of thermal cycling

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Figure 5

Optical, chroma, and electrical measurement system

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Figure 6

SEM microstructure of the sheared nanosilver joint

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Figure 7

Die-bonding strength distribution of nanosilver sintered LED modules

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Figure 8

Luminous flux with current for three different materials connected LED modules before hygrothermal aging

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Figure 9

Luminous flux with hygrothermal aging time for three different materials connected LED modules

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Figure 10

Luminous flux with current for three different materials connected LED modules after 500 h hygrothermal aging: (a) nanosilver paste, (b) Sn3Ag0.5Cu, and (c)silver epoxy

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Figure 11

Luminous flux with thermal cycles for Sn3Ag0.5Cu and nanosilver paste connected LED modules

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Figure 12

Luminous flux with current for Sn3Ag0.5Cu and nanosilver paste connected LED module under different thermal cycles

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