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Research Papers

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

[+] Author and Article Information
Varghese Panthalookaran

 Rajagiri School of Engineering & Technology (RSET), Rajagiri Valley, Kakkanad, Kochi-682039 Kerala, Indiavarghese@rajagiritech.ac.in

J. Electron. Packag 132(3), 031007 (Sep 09, 2010) (7 pages) doi:10.1115/1.4002009 History: Received August 21, 2009; Revised May 07, 2010; Published September 09, 2010; Online September 09, 2010

Natural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural convection mode is usually insufficient for electronic cooling and it requires enhancement. Chimneylike flows developed within the cabinets of electronic devices can provide better mass flow and heat transfer rates and can lead to greater cooling efficiency. Constraints in the design of natural convection cooling systems include efficiency of packing, aesthetics, and concerns of material reduction. In this paper, methods based on computational fluid dynamics are used to study the effects of parameters such as (1) vertical alignment of the slots, (2) horizontal alignment of slots, (3) area of slots, (4) differential slot opening, and (5) zonal variation in heat generation on natural convection cooling within such design constraints. Insights thus derived are found useful for designing an energy-efficient and ecofriendly cooling system for electronic devices.

Copyright © 2010 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Cabinet containing transformer and MOSFET arrays as heat-generating elements

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Figure 2

Sketch of vertical alignment of bottom and top arrays of slots on the left, right, and back walls of the cabinet

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Figure 3

Enhancement of mass flow rate of air with vertical separation of the array of slots

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Figure 4

Heat dissipation efficiency versus vertical separation of the array of slots

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Figure 5

Maximum and average temperatures of transformer and MOSFET array with respect to the increasing vertical separation between bottom and top arrays of slots

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Figure 6

Steady-state temperature profiles on the heating elements corresponding to the case with 13.8 cm vertical separation between bottom and top arrays

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Figure 7

Steady-state flow profiles within the cabinet corresponding to the case with 13.8 cm vertical separation between bottom and top arrays

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Figure 8

Sketch of staggered alignment of slots on the left, right, and back walls of the cabinet

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Figure 9

Variation of mass flow rate versus area ratio

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Figure 10

Variation of heat dissipation efficiency versus area ratio of outlet slots

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Figure 11

Variation of mass flow rate with absolute area of outlet slots at constant area ratio

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Figure 12

Maximum and average surface temperatures of the transformer and MOSFET arrays plotted against the mass flow rates for constant area ratio

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Figure 13

Heat dissipation efficiency versus absolute outlet area for constant area ratio

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Figure 14

Sketch of differential areas slots on the left, right, and back walls of the cabinet

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Figure 15

Heat dissipation efficiency corresponding to heat flux distribution ratios

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