Technical Briefs

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

[+] Author and Article Information
Huy N. Phan, Dereje Agonafer

Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, Arlington, TX

J. Electron. Packag 132(2), 024501 (Jun 23, 2010) (4 pages) doi:10.1115/1.4001831 History: Received January 16, 2010; Revised May 18, 2010; Published June 23, 2010; Online June 23, 2010

Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal management of three-dimensional integrated circuits (3D-ICs) leads to reduction in performance, reliability, and ultimately system catastrophic failure. Heat dissipation of 3D systems is highly nonuniform and nonunidirectional due to many factors such as power architectures, transistors packing density, and real estate available on the chip. In this study, the development of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13°C utilizing a multidimensional configured thermoelectric will be presented.

Copyright © 2010 by American Society of Mechanical Engineers
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Figure 1

(a) Passive processor cooling and (b) active processor cooling using thermoelectric cooler for conventional non-3D-IC processors

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Figure 2

Different dice stacking configurations

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Figure 3

Conventional cooling methods applied to 3D-ICs

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Figure 4

Low-power high-integration 3D-PCB-package (10×10×10 mm3)(3)

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Figure 5

Motherboard for Intel® Pentium® 4 processor (courtesy of Gigabyte)

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Figure 6

Unidirectional cascade thermoelectric cooling configuration

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Figure 8

Air flow bench test setup

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Figure 9

Processor temperature as a function of air flow rates for 25 W processor

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Figure 10

Processor temperature as a function of air flow rates and TEM input power for 25 W processor (1D cooling with TEM)

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Figure 11

MHTS processor temperature as a function of air flow rates and TEM input power (1.3–230 W) for 25 W processor




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