Research Papers

An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays

[+] Author and Article Information
D. K. Harris1

Department of Mechanical Engineering, 250 Ross Hall, Auburn University, Auburn, AL 36849harridk@auburn.edu

A. Palkar

 International Paint, LLC, 6001 Antoine Drive, Houston, TX 77091aypalkar@gmail.com

G. Wonacott

 San Diego Composites, Inc., 9550 Ridgehaven Court, San Diego, CA 92123gwonacott@sdcomposites.com

R. Dean

Department of Electrical and Computer Engineering, 200 Broun Hall, Auburn University, Auburn, AL 36849deanron@auburn.edu

F. Simionescu

 URS Corporation-Washington Division, 2 Perimeter Park South, Birmingham, AL 35243florentina.simionescu@wgint.com


Corresponding author.

J. Electron. Packag 132(2), 021005 (Jun 23, 2010) (8 pages) doi:10.1115/1.4001745 History: Received October 09, 2009; Revised March 26, 2010; Published June 23, 2010; Online June 23, 2010

This study details the fabrication and measurements of a water-filled 5 mm wide by 10 mm long silicon microheat pipe (MHP) array consisting of 22100μm square channels. This study is unique in that many experimental results reported in open literature are for single channel microheat pipes. The number of channels in the array and the fluid charge used here were optimized under a separate study. A number of experiments were carried out on the specimen MHPs to determine their effective thermal conductivity and comparisons were made with previous results found in literature. The testing methodology was designed to remove systematic biases and the array thermal performance measurements are reported in terms of a silicon equivalence by identically measuring an uncharged empty silicon array as a baseline measurement. Two separate water-filled specimens were made, independently tested, and are reported to have thermal conductivities of 261W/mK and 324W/mK, representing a silicon equivalence of 1.8 and 2.2, respectively. All testing was performed in a horizontal orientation.

Copyright © 2010 by American Society of Mechanical Engineers
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Figure 1

MHP test sample assembly: die dimensions are 5 mm wide by 10 mm long by 1.25 mm thick

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Figure 2

MHP attached onto testing circuit

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Figure 4

Temperature difference between evaporator and condenser versus power input for both empty and water-filled MHPs and a solid silicon test sample

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Figure 5

Comparison of the current study results with various other data reported in literature




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