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Technical Briefs

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

[+] Author and Article Information
M. K. Abdullah, M. A. Mujeebu, Horizon Gitano

School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia

M. Z. Abdullah1

School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysiamezul@eng.usm.my

Z. M. Ariff

School of Material and Mineral Resources, Universiti Sains Malaysia, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia

R. Razali, K. A. Ahmad

School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia

1

Corresponding author.

J. Electron. Packag 132(1), 014502 (Mar 04, 2010) (6 pages) doi:10.1115/1.4000719 History: Received August 12, 2007; Revised September 28, 2009; Published March 04, 2010; Online March 04, 2010

A three-dimensional numerical model is developed to simulate the mold filling behavior in the plastic encapsulation of microchips. The conventional Hele–Shaw approximation is inadequate to analyze a complex molding compound flow behavior with multiple microchips in a single cavity. The developed numerical algorithm is based on the finite difference method combined with the robustness of volume of fluid volume-tracking method to solve the two-phase flow field in complex mold and die geometries. Twelve dies are arranged in a matrix-array in a single mold cavity. Short-shot experimental data are used to validate the numerical results for the melt flow front at different flow times. Close agreement between the experimental data and the numerical results demonstrates the applicability of the present computational model for the simulation of practical epoxy molding compound encapsulation.

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Copyright © 2010 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

The test cavity: (a) without mesh and (b) uniform mesh

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Figure 2

Flow chart of the interpolation program for the multigrid calculation

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Figure 3

Flow chart of a 3D mold flow analysis

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Figure 4

Comparison of experimental data with simulation results

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Figure 5

Average melt-front displacement at 4 mm/s

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Figure 6

3D predicted melt-front advancement at distinct time steps

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Figure 7

The fountain flow phenomenon

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Figure 8

Viscosity versus shear rate for EMC

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Figure 9

The pressure distribution within the cavity

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