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Research Papers

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

[+] Author and Article Information
Myung Jin Yim

 Numonyx, Inc., Mesa, AZ 85210

Yi Li, Kyoung Sik Moon, C. P. Wong

School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332-0405

J. Electron. Packag 132(1), 011007 (Mar 19, 2010) (5 pages) doi:10.1115/1.4001229 History: Received August 28, 2009; Revised January 03, 2010; Published March 19, 2010; Online March 19, 2010

This paper describes the development and characterization of anisotropically conductive films (ACFs) incorporated with copper (Cu) particles as electrically conductive fillers for environmentally friendly, low cost, high electrical, and high thermal interconnect applications in microelectronics packaging. The Cu particle surface modification by a coupling agent and its effects on the electrical conductivity and thermal stability of Cu-filled ACF joints were investigated for the potential alternatives of conventional Au-coated polymer and Au-coated Ni-filled ACFs. The surface characteristics of a thin film of the coupling agent on copper surfaces such as element analysis, their hydrophobicity, and thermal stability were evaluated. The treated Cu ball-filled ACF showed the lowest contact resistance 1.0×105Ω, higher current carrying capability, and higher thermal stability of ACF joints compared with the conventional Au-coated polymer ball and Au-coated Ni ball-filled anisotropically conductive adhesives.

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Copyright © 2010 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic structures of (a) flip chip bonding using ACA material, (b) mechanical contact mechanism of soft Au-coated polymer sphere, and (c) hard Au-coated Ni sphere between two electrodes

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Figure 2

Schematics of (a) contact angle measurement and (b) XPS analysis (take-off angle: 55 deg and sampling depth: 60 Å) for the CA treated Cu surfaces

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Figure 3

Schematic illustration of I-V measurement for ACA joint

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Figure 4

Results on the contact angles of the CA treated copper samples and the average contact angle of the freshly cleaned untreated sample with variation in the dipping times

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Figure 5

Surface chemistry schematics of (a) pristine Cu surface and (b) organofunctional silane treated Cu surface

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Figure 6

Contact angle versus aging temperatures (10 min) for the CA treated copper samples

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Figure 7

XPS spectrum of copper surfaces (a) bare copper surface and (b) CA coated copper surface

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Figure 8

Electrical properties of ACA with different metallic particles (a) I-V relationships and (b) I-R relationships

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Figure 9

Contact resistance changes of Cu-filled ACA and conventional ACA joints as a function of temperature up to 240 °C

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