Technical Briefs

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

[+] Author and Article Information
D. Bhate

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088

G. Subbarayan

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088ganeshs@purdue.edu

J. Zhao, V. Gupta, D. Edwards

 Texas Instruments, Dallas, TX 75243

J. Electron. Packag 131(4), 044502 (Nov 12, 2009) (3 pages) doi:10.1115/1.4000208 History: Received October 02, 2008; Revised June 14, 2009; Published November 12, 2009; Online November 12, 2009

Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys, the importance of the load history, and the wide variation in package constructions employed by the microelectronics industry. While material behavior can be captured by means of valid constitutive models, the empirical failure models in common use are strongly dependent on package construction due to the fact that they are derived from tests of solder joints with heterogeneous stress and microstructural variation. Despite this limitation, the empirical models have been used to identify reliable choices among package design alternatives. In this technical brief, some of the key limitations that the user of empirical models must be aware of are addressed. Physical arguments are proposed in order to justify the appropriate assumptions that may be made in the life model. Using data from two different sources in the literature, the constants in the empirical models are shown to be dependent on the solder joint geometry. Alternative fits to experimental data that reduce the dependence of the fits on solder joint geometry are proposed.

Copyright © 2009 by American Society of Mechanical Engineers
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Grahic Jump Location
Figure 1

Schematic showing top view of a crack in a circular joint

Grahic Jump Location
Figure 2

Distribution of elements undergoing plastic deformation is strongly dependent on the aspect ratio of the joint

Grahic Jump Location
Figure 3

Dependence of parameter A on the ratio of pad diameter and standoff height




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