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Research Papers

A Novel Ceramic Packaging Technique Using Selective Induction Heating

[+] Author and Article Information
Sheng Liu, Wenming Liu, Changyong Lin

Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China; Institute for Microsystems, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

Mingxiang Chen1

Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China; Institute for Microsystems, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, Chinachimish@163.com

1

Corresponding author.

J. Electron. Packag 131(4), 041010 (Nov 12, 2009) (5 pages) doi:10.1115/1.4000366 History: Received April 13, 2009; Revised September 16, 2009; Published November 12, 2009; Online November 12, 2009

A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested and evaluated. For high-frequency (f=350kHz) induction heating, the temperature of cover edges near solder-loop reached up to 320°C in several seconds, hermetic seal of the ceramic package can be promised because of solder reflowing, while the temperature of the ceramic bottom was only about 100°C, so thermal-sensitive devices and integrated circuits inside the ceramic package can be protected from high-temperature damage. Temperature variation and distribution were evaluated by an infrared imager, and it agreed well with simulation results. Finally, tensile strength from 4.0 MPa to 13.0 MPa was achieved and the fracture interfaces were examined and analyzed depending on the induction heating time and packaging pressure.

Copyright © 2009 by American Society of Mechanical Engineers
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References

Figures

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Figure 15

Simulated temperature contours at 3.5 s

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Figure 1

Schematic of induction heating packaging system

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Figure 2

Structure of ceramic package (unit: mm)

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Figure 3

FEM of the ceramic crust

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Figure 4

Indirect coupling process of induction heating

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Figure 5

Process of the ceramic packaging by induction heating

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Figure 6

Ceramic crust and the cover with solder preform

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Figure 7

Sketch of the induction heating system

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Figure 8

Temperature comparison between experiment and simulation

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Figure 9

Thermal image of the ceramic package on induction heating and temperature distribution

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Figure 10

Micrograph of the side surface of sample I in group 1

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Figure 11

Micrograph of the side surface of sample II in group 6

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Figure 12

Fractured sample I in group 1 after tensile

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Figure 13

Cross section of packaged sample II in group 6

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Figure 14

Temperature contours of the circular ceramic package model b when induction heating time is 2 s

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Figure 16

Numerically predicted temperature contours of the circular ceramic-crust model c when induction heating time is 1 s

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Figure 17

Predicted temperature variation in points A and B in model c

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