A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested and evaluated. For high-frequency induction heating, the temperature of cover edges near solder-loop reached up to in several seconds, hermetic seal of the ceramic package can be promised because of solder reflowing, while the temperature of the ceramic bottom was only about , so thermal-sensitive devices and integrated circuits inside the ceramic package can be protected from high-temperature damage. Temperature variation and distribution were evaluated by an infrared imager, and it agreed well with simulation results. Finally, tensile strength from 4.0 MPa to 13.0 MPa was achieved and the fracture interfaces were examined and analyzed depending on the induction heating time and packaging pressure.