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Research Papers

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

[+] Author and Article Information
Chuen-Ching Wang

Department of Information Management, Shu-Zen College of Medicine and Management, 452 Hwan-chio Road, Luju Kaohsiung, Hsien 82144, Taiwanccwang@szmc.edu.tw

Yao-Ting Ye

 M-Extension Electronics Corporation, No. 1 Section 3rd, Technology East Road, Qingxi Town of Dongguan City, Guangdong 523641, Chinayt_yeh@meecl.com

Jing-Fung Lin

Department of Computer Application Engineering, Far East University, No. 49, Chung Hua Road, Hsin-Shih, Tainan County 744, Taiwanjacklin@cc.feu.edu.tw

J. Electron. Packag 131(4), 041009 (Nov 12, 2009) (7 pages) doi:10.1115/1.4000363 History: Received April 18, 2008; Revised May 15, 2009; Published November 12, 2009; Online November 12, 2009

This study develops a novel glass cover chip (GCC) technique for the packaging of CMOS image sensors (CIS), in which the glass cover plate is attached directly to the chip using a nonconductive adhesive film. Taking the adhesive force between the glass plate and the chip as a performance indicator, a series of Taguchi trials are performed to establish the optimal GCC processing conditions. The experimental results confirm the feasibility of the proposed packaging technique and indicate a volume reduction of 59.47% compared with the traditional CIS package. Furthermore, the simulation results reveal that the heat dissipation efficiency of the proposed CIS package exceeds that of the traditional package by 245%.

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Copyright © 2009 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Transverse cross section of conventional CIS structure

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Figure 2

Modified GCC package (13)

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Figure 3

Proposed CIS package

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Figure 4

Principal factors determining adhesive force between the glass plate and the chip

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Figure 5

Characteristic response graph of each control factor

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Figure 6

Temperature distribution of the primitive design at t=0 s

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Figure 7

Temperature distribution of the primitive design at t=3600 s

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Figure 8

Temperature distribution of the new design at t=0 s

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Figure 9

Temperature distribution of the new design at t=3600 s

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Figure 10

Heat dissipation curves of traditional and proposed CIS packages

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Figure 11

Basic appearance and dimensions of the traditional package

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Figure 12

Basic appearance and dimensions of the proposed package

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