Research Papers

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

[+] Author and Article Information
Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou

Centre for Advanced Materials Joining, University of Waterloo, Waterloo, ON, N2L 3G1, Canada

Jae Pil Jung

Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Korea

J. Electron. Packag 131(4), 041007 (Oct 29, 2009) (5 pages) doi:10.1115/1.4000281 History: Received July 12, 2008; Revised September 16, 2009; Published October 29, 2009

Bumping of microcircuits and substrates establishes interconnect points required for subsequent bonding of microelectronic components, allowing for power and data distribution. Simultaneous ultrasonic bonding of individual Au balls promises to accelerate bumping processes and is studied using a finite element model. The model covers the static forces at the end of a successful bonding operation and analyzes the interfacial stresses between bumps and substrate. The modeling shows the vertical forces acting on the bumps when a lateral displacement of the bonding tool is applied. When designing a practical bonding application, the control of such vertical forces is recommended. A sensitivity analysis is conducted to study the effect of the main factors on the model responses. This analysis reveals that variations in bump height and bonding tool elastic modulus are the major factors affecting the forces on the bumps.

Copyright © 2009 by American Society of Mechanical Engineers
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Grahic Jump Location
Figure 1

Layout and naming of model parts. (a) cross-sectional view; (b) top view of substrate with bumps; (c) detailed view of bump and pad. Drawing not to scale.

Grahic Jump Location
Figure 2

Main boundary conditions for (a) N model and (b) D model. Adhesive bottom kept fixed. Dimensions not to scale.

Grahic Jump Location
Figure 3

View of typical mesh near interface between bump and pad. One-quarter not shown for clarity.

Grahic Jump Location
Figure 4

Normal stress distribution σzz in xy-plane at 0.5μm above bottom interface of Au bumps

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Figure 5

Variation in bump position indicated by arrows. Not to scale.




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