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Research Papers

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

[+] Author and Article Information
Dominiek Degryse1

 IMEC, Kapeldreef 75, B-3001 Leuven, Belgium; Vakgroep Toegepaste Materiaalwetenschappen, Universiteit Gent, Sint-Pietersnieuwstraat 41, B-9000 Gent, Belgiumdominiek.degryse@lid.kviv.be

Bart Vandevelde, Eric Beyne

 IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

Joris Degrieck

Vakgroep Toegepaste Materiaalwetenschappen, Universiteit Gent, Sint-Pietersnieuwstraat 41, B-9000 Gent, Belgium

1

Corresponding author. Present address: Katholieke Hogeschool, Sint-Lieven, Gebroeders Desmetstraat 1, B-9000 Gent, Belgium.

J. Electron. Packag 131(4), 041003 (Oct 21, 2009) (6 pages) doi:10.1115/1.4000209 History: Received November 02, 2008; Revised June 25, 2009; Published October 21, 2009

Electronic packages are multimaterial structures. Their reliability is a major concern for the electronic industry and therefore widely studied. Apart from the electrical performance, the mechanical stability also needs attention. A dreaded failure cause is delamination. Therefore it is interesting to have a modeling tool, which can provide information on possible delamination risks. In this paper, a short overview of existing appropriate analyzing techniques is presented, focusing on the fracture-mechanics approach. The implementation of the method using energy release rate components is discussed. However, as in all modeling applications, the need for “critical material data” is also at hand. Therefore, the shear test is demonstrated to serve as a characterization tool. The Si-BCB interface is applied as test-case. In order to obtain the critical material data for this interface, a set of experiments is designed and performed. Due to the brittle failure observed in the experiments, only information about the onset of the delamination is obtained, leading to a crack extension locus. By comparing the experimental results and the numerical finite element results, an estimation on this crack extension locus (in the G1-G2 plane) can be made. This information can be used in later calculations on the reliability of components including Si-BCB interfaces.

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Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 1

Implementation of the fracture-mechanics approach for interface characterization in finite element models

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Figure 2

Updated shear test, adapted to the requirements set by the fracture-mechanics approach. The right part indicates the expected force-displacement relation.

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Figure 3

Schematic presentation of the crack extension locus for an interface

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Figure 4

Test sample: top view. At the left, a test sample after the shear test is shown; the BCB bump has completely delaminated from the Si. At the right, an untested test sample is shown.

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Figure 5

Parameter definitions used in the Si-BCB shear test sample fabrication.

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Figure 6

Shear test equipment used for the interface shear test.

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Figure 7

Influence of the width of the BCB bump on the crack extension force during the shear test for different initial crack lengths. The bars indicate one standard deviation around the average value.

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Figure 8

Influence of the length of the BCB bump on the crack extension force during the shear test for different initial crack lengths. The bars indicate one standard deviation around the average value.

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Figure 9

Finite element model of the shear test on the Si-BCB test sample, indicating the applied parameters.

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Figure 10

Modeling results for the case of an initial crack of 20 μm along the Si-BCB interface. The critical energy release rate components are determined at the average value for the crack extension value ±1 standard deviation.

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Figure 11

Estimation of the crack extension locus for the Si-BCB interface, based on the shear test results, where a constant crack extension force is assumed.

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