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Research Papers

A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

[+] Author and Article Information
Chuen-Ching Wang

 Shu-Zen College of Medicine and Management, No. 452, Hwan-chio Rd., Luju, Kaohsiung Hsien, Taiwan 82144ccwang@mail.szmc.edu.tw

Wen-Ran Yang, Jin-Jia Chen, Wei-Wen Shi

Department of Electrical Engineering, National Changhua University of Education, No. 2, Shi-Da Rd., Changhua, Taiwan 500

J. Electron. Packag 131(4), 041002 (Oct 21, 2009) (8 pages) doi:10.1115/1.4000207 History: Received September 28, 2008; Revised July 11, 2009; Published October 21, 2009

The explosive growth in the use of the Internet and multimedia applications in both the home and the office has fueled the requirement for high-bandwidth communication systems capable of processing huge volumes of data in a prompt and reliable manner. Plastic optical fiber (POF) has emerged as an ideal solution for meeting this requirement and is now specified by many architects as a simple, one-cable solution for home and office data communication networks. This study presents a modified flip-chip light emitting diode (LED) package for use in short-distance, POF-based communication systems. In contrast to the planar surface of the traditional design, the proposed LED package has a curved boundary surface between the underfill and the air. This boundary surface functions as a virtual lens, which focuses the light emitted by the LED into the acceptance cone of the optical fiber such that the amount of light coupled into the fiber core is maximized. The proposed design yields an average coupling efficiency of around 49.6% over an LED-optical core misalignment range of 0.4–3 mm. Furthermore, the curved boundary surface reduces the distance between the emitting source and the ambient environment; therefore, it improves the thermal dispersion efficiency of the LED package.

Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 1

Traditional design of flip-chip LED package

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Figure 2

Virtual lens design of flip-chip LED package

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Figure 3

Use of virtual lens in enhancing light coupling efficiency: TIR at virtual lens boundary and subsequent redirection by mirrorlike surfaces of conical opening

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Figure 4

TracePro simulation results of the use of virtual lens in enhancing light coupling efficiency

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Figure 5

Light coupling enhancement of LEDs by a direct light coupling using matching epoxy resin

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Figure 6

Light coupling enhancement of LEDs using microlens

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Figure 7

Schematic illustration of LED—optical fiber coupling arrangement: side view(left) and plane view (right)

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Figure 8

Variation in light coupling efficiency with etching angle in traditional and proposed flip-chip LED packages

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Figure 9

Variation in light coupling efficiency with thinness of virtual lens as a function of refractive index of underfill material, the radius of curvature, and the thickness of virtual lens

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Figure 10

LED illumination charts for unpackaged LED

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Figure 11

LED illumination charts for traditional flip-chip LED

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Figure 12

LED illumination charts for virtual lens flip-chip LED

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Figure 13

Variation in light coupling efficiency with misalignment distance

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Figure 14

Field patterns in unpacked LED

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Figure 15

Field patterns in traditional flip-chip LED

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Figure 16

Field patterns in virtual lens flip-chip LED

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Figure 17

Variation in maximum temperature with input power in proposed LED package and traditional LED package

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Figure 18

Thermal dissipation in traditional flip-chip LED

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Figure 19

Thermal dissipation in proposed flip-chip LED

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