Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

Myung Ki Sung; Issam Mudawar

doi:10.1115/1.3111253

Journal of Electronic Packaging | Volume 131 | Issue 2 | Research Paper

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Research Papers

Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

Myung Ki Sung and Issam Mudawar

[+] Author and Article Information

Myung Ki Sung

Boiling and Two-Phase Flow Laboratory (BTPFL), Purdue University International Electronic Cooling Alliance (PUIECA), Mechanical Engineering Building, 585 Purdue Mall, West Lafayette, IN 47907-2088

Issam Mudawar¹

Boiling and Two-Phase Flow Laboratory (BTPFL), Purdue University International Electronic Cooling Alliance (PUIECA), Mechanical Engineering Building, 585 Purdue Mall, West Lafayette, IN 47907-2088mudawar@ecn.purdue.edu

Corresponding author.

J. Electron. Packag 131(2), 021013 (Apr 21, 2009) (10 pages) doi:10.1115/1.3111253 History: Received July 01, 2008; Revised January 08, 2009; Published April 21, 2009

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Abstract

This study examines the cooling performance of two hybrid cooling schemes that capitalize on the merits of both microchannel flow and jet impingement to achieve the high cooling fluxes and uniform temperatures demanded by advanced defense electronics. The jets supply HFE 7100 liquid coolant gradually into each microchannel. The cooling performances of two different jet configurations, a series of circular jets and a single slot jet, are examined both numerically and experimentally. The single-phase performances of both configurations are accurately predicted using 3D numerical simulation. Numerical results point to complex interactions between the jets and the microchannel flow, and superior cooling performance is achieved by optimal selection of microchannel height. The two-phase cooling performance of the circular-jet configuration is found superior to that of the slot jet, especially in terms of high-flux heat dissipation. Unprecedented cooling fluxes, as high as $1127 W / {cm}^{2}$ , are achieved with the circular jets without incurring CHF.

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References

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Figures

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Figure 1

Schematic of flow control system

(a) Test module construction and (b) cross section of module assembly

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Figure 2

(a) Test module construction and (b) cross section of module assembly

Schematics of unit cells for (a) circular jets and (b) slot jet

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Figure 3

Schematics of unit cells for (a) circular jets and (b) slot jet

Numerical predictions of coolant velocity for Hch=1 mm and microchannel bottom wall temperature for Hch=1 and 3 mm along the centerline of microchannel for (a) Ujet=1 m/s and (b) Ujet=5 m/s

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Figure 4

Numerical predictions of coolant velocity for Hch=1 mm and microchannel bottom wall temperature for Hch=1 and 3 mm along the centerline of microchannel for (a) Ujet=1 m/s and (b) Ujet=5 m/s

Numerical predictions of coolant velocity for Hch=6 mm and microchannel bottom wall temperature for Hch=3 and 6 mm along the centerline of microchannel for (a) Ujet=1 m/s and (b) Ujet=5 m/s

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Figure 5

Numerical predictions of coolant velocity for Hch=6 mm and microchannel bottom wall temperature for Hch=3 and 6 mm along the centerline of microchannel for (a) Ujet=1 m/s and (b) Ujet=5 m/s

Thermocouple readings inside heater block versus jet Reynolds number for (a) circular jets and (b) slot jet

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Figure 6

Thermocouple readings inside heater block versus jet Reynolds number for (a) circular jets and (b) slot jet

(a) Slot-jet pressure drop versus Reynolds number for q″eff=32 and 80 W/cm2 and (b) comparisons of pressure drops for circular jets and slot jet

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Figure 7

(a) Slot-jet pressure drop versus Reynolds number for q″eff=32 and 80 W/cm2 and (b) comparisons of pressure drops for circular jets and slot jet

Numerical predictions of microchannel sidewall temperature distribution for (a) circular jets at q″eff=162.15 W/cm2 and Q=3.71×10−5 m3/s, and (b) slot jet at q″eff=76.37 W/cm2 and Q=4.51×10−5 m3/s

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Figure 8

Numerical predictions of microchannel sidewall temperature distribution for (a) circular jets at q″eff=162.15 W/cm2 and Q=3.71×10−5 m3/s, and (b) slot jet at q″eff=76.37 W/cm2 and Q=4.51×10−5 m3/s

Boiling curves measured at xtc1, xtc2, xtc3, and xtc4 for (a) circular jets at ΔTsub=68.2°C and Q=8.77×10−6 m3/s, and (b) slot jet at ΔTsub=68.1°C and Q=7.15×10−6 m3/s

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Figure 9

Boiling curves measured at xtc1, xtc2, xtc3, and xtc4 for (a) circular jets at ΔTsub=68.2°C and Q=8.77×10−6 m3/s, and (b) slot jet at ΔTsub=68.1°C and Q=7.15×10−6 m3/s

Effects of subcooling on boiling curve for (a) circular jets at Q=2.15×10−5 m3/s and (b) slot jet at Q=3.53×10−6 m3/s

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Figure 10

Effects of subcooling on boiling curve for (a) circular jets at Q=2.15×10−5 m3/s and (b) slot jet at Q=3.53×10−6 m3/s

Effects of flow rate on boiling curve for (a) circular jets at ΔTsub=68.2°C and (b) slot jet at ΔTsub=68.1°C

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Figure 11

Effects of flow rate on boiling curve for (a) circular jets at ΔTsub=68.2°C and (b) slot jet at ΔTsub=68.1°C

Bubble growth and condensation inside hybrid module for (a) circular jets and (b) slot jet

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Figure 12

Bubble growth and condensation inside hybrid module for (a) circular jets and (b) slot jet

Comparison of predictions of two-phase heat transfer coefficient correlation with HFE 7100 data for circular jets and slot jet

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Figure 13

Comparison of predictions of two-phase heat transfer coefficient correlation with HFE 7100 data for circular jets and slot jet

Boiling curves for circular jets with Ujet=2.75 m/s and Ujet=6.01 m/s

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Figure 14

Boiling curves for circular jets with Ujet=2.75 m/s and Ujet=6.01 m/s

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Sung M, Mudawar I. Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics. ASME. J. Electron. Packag. 2009;131(2):021013-021013-10. doi:10.1115/1.3111253.

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Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

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