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Research Papers

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

[+] Author and Article Information
Mustapha Faraji

Fluid Mechanics and Energetic Laboratory, Faculty of Sciences Semlalia, and Department of Physics, Cadi Ayyad University, P.O. Box 2390, Marrakech 40000, Moroccofarajimustapha@yahoo.fr

Hamid El Qarnia

Fluid Mechanics and Energetic Laboratory, Faculty of Sciences Semlalia, and Department of Physics, Cadi Ayyad University, P.O. Box 2390, Marrakech 40000, Moroccoelqarnia@ucam.ac.ma

J. Electron. Packag 131(2), 021011 (Apr 03, 2009) (10 pages) doi:10.1115/1.3103953 History: Received July 08, 2008; Revised December 04, 2008; Published April 03, 2009

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) (n-eicosane with melting temperature Tm=36°C) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A two-dimensional mathematical model was developed in order to analyze and optimize a heat sink. The governing equations for masse, momentum, and energy transport were developed and discretized by using the volume control approach. The resulting algebraic equations were next solved iteratively by using tri diagonal matrix algorithm. A series of numerical investigations were conducted in order to examine the effects of the heat generation based Rayleigh number, Ra, and the position of the bottom electronic component, Lh, on the thermal behavior of the proposed cooling system. Results are obtained for velocity and temperature distributions, maximum temperature heat sources, percentage contribution of plate (substrate) heat conduction on the heat removal from electronic components, temperature profile within finite conductive plate and local heat flux density at the plate—modules/PCM interface. The effect of these two key parameters on the electronic component working time (time required by electronic components to reach a critical temperature, Tcr) was analyzed.

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Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 2

Numerical and experimental melting front positions

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Figure 3

Temporal variation in maximal temperature, Tmax, and the melt fraction, f; Ra1=1.19×109, Ra2=2.55×109, and Ra3=5.10×109

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Figure 4

Substrate temperature profile; Ra1=1.19×109, Ra2=2.55×109, Ra3=5.10×109, x=Xs/2, and t=4320 s

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Figure 5

Isotherms for Rayleigh numbers, Ra1=1.19×109 and Ra2=5.10×109

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Figure 6

Streamlines for Rayleigh numbers, Ra1=1.19×109 and Ra2=5.10×109

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Figure 7

Local heat flux density at the left hot wall/PCM interface, Ra=1.19×109

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Figure 8

Effect of the position, Lh, on temperature profile within the substrate; Ra=5.10×109 and t=4320 s

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Figure 9

Effect of the position, Lh, on the maximal temperature, Tmax, and on the liquid fraction, f; Ra=5.10×109

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