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Research Papers

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

[+] Author and Article Information
Yutaka Kumano

Printed Electronics and EMC Technology Development Office, Panasonic Corporation, 1006 Kadoma, Kadoma City, Osaka 571-8501, Japankumano.yutaka@jp.panasonic.com

Tetsuyoshi Ogura, Toru Yamada

Printed Electronics and EMC Technology Development Office, Panasonic Corporation, 1006 Kadoma, Kadoma City, Osaka 571-8501, Japan

J. Electron. Packag 131(2), 021007 (Apr 02, 2009) (6 pages) doi:10.1115/1.3103947 History: Received April 22, 2008; Revised December 11, 2008; Published April 02, 2009

A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs are divided into multiple regions. The effective anisotropic thermal conductivity of each region is then assigned as follows. All the regions are divided into smaller subregions whose size is below the pattern width. The thermal conductivity of each subregion is defined by the property of the material at the center of the subregion. Next, a thermal circuit network composed of all the subregions is generated, and finally the anisotropic thermal conductivities of each region are computed by solving this thermal network matrix. When boards are divided into multiple regions, there is a convergence region size under which the analytical results show no further change. In this paper, the relationship between the size of the divided regions and the accuracy of the analytical results was investigated. It was confirmed that the calculated semiconductor junction temperatures were precisely coincident with the experimental results when the size of the regions was less than 20 times the line pattern width.

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Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 1

Concept of SIMPACT

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Figure 2

Example of layer numbering

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Figure 3

Example of extreme patterns in a layer: (a) entirely x-directional pattern and (b) entirely y-directional pattern

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Figure 4

Example of thermal network

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Figure 5

Typical line patterns: (a) 0° line pattern, (b) 90° line pattern, and (c) 45° line pattern

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Figure 6

Division example of 45° line pattern region

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Figure 7

Example of material assignment

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Figure 8

Cross-sectional view of prepared SIMPACT device

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Figure 9

Photograph of experimental sample

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Figure 10

Measurement environment

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Figure 11

Temperature dependence of voltage drop

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Figure 12

Analytical model: (a) novel analytical model A (coarsest model), (b) novel analytical model E (finest model), and (c) conventional analytical model

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Figure 13

Accuracy dependence as a function of division ratio

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Figure 14

Relationship between experimental and analytical results: (a) upper IC and (b) embedded lower IC

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