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Research Papers

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

[+] Author and Article Information
Afzal Husain

Department of Mechanical Engineering, Graduate School, Inha University, 253 Yonghyun-Dong, Nam-Gu, Incheon, 402-751, Republic of Koreaafzal19@inha.edu

Kwang-Yong Kim1

Department of Mechanical Engineering, Inha University, 253 Yonghyun-Dong, Nam-Gu, Incheon, 402-751, Republic of Koreakykim@inha.ac.kr

1

Corresponding author.

J. Electron. Packag 131(2), 021005 (Apr 01, 2009) (6 pages) doi:10.1115/1.3103931 History: Received September 12, 2007; Revised January 07, 2009; Published April 01, 2009

A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function. Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with the analytical and experimental results and the values of objective function are calculated at the specified design points. Using the numerically evaluated objective-function values, a polynomial response surface model is constructed and the optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of the microchannel heat sink by decreasing thermal resistance of about 12% of the reference shape. Sensitivity of objective function to design variables has been studied to utilize the substrate material efficiently.

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Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 6

Velocity (m/s) contours on the middle yz plane; (a) reference shape (29) and (b) optimum shape

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Figure 5

Temperature-rise (°C) contours on the middle yz plane; (a) reference shape (29) and (b) optimum shape

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Figure 4

Temperature-rise (°C) contours on the middle xz plane; (a) reference shape (29) and (b) optimum shape

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Figure 3

Sensitivity analysis of objective function near the design point; (a) reference shape (29) and (b) optimum shape

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Figure 2

Variations in thermal resistance with design variables at (a) η=0.5, (b) η=0.75, and (c) η=1.0

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Figure 1

Schematic of the microchannel heat sink

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