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Research Papers

Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

[+] Author and Article Information
Esam M. Alawadhi

Department of Mechanical Engineering, Kuwait University, P.O. Box 5969, Safat 13060, Kuwaitesam@kuc01.kuniv.edu.kw

J. Electron. Packag 131(1), 011011 (Feb 13, 2009) (11 pages) doi:10.1115/1.3068322 History: Received June 09, 2008; Revised September 27, 2008; Published February 13, 2009

In this research, thermal management of an electronic device using the input power is investigated numerically using the finite element method. The considered geometry consists of a horizontal channel with three volumetrically heated chips mounted on the bottom wall of the channel. The magnitude of the channel’s inlet velocity is varied with the variation of heat generation in the chips. The thermal characteristics of the system are presented, and compared with thermal characteristics of a system at a steady state condition. The effect of the Reynolds number and the oscillating period of the heat generation on the chips’ average temperature and Nusselt number is presented. The pressure drop in the channel is also calculated. The results indicated that the transient operating condition causes temperature to be higher than steady state by more than 45%, and difference between the transient and steady operations is reduced if the frequency is high. However, flow frequency has nearly no effect on the pressure drop in the channel.

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Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 1

(a) A typical variation of a processor’s input power and temperature, and (b) the fan speed under different control techniques

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Figure 2

Thermal control using the input power

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Figure 3

Schematic of the problem

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Figure 4

Finite element mesh at the (a) chips’ region, and (b) close-up view at one of the chips

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Figure 5

The local Nusselt number of the present and Ref. 3 models for the (a) first and (b) second chips

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Figure 6

Flow streamlines during one periodic cycle at ωt*= (a) 0, (b) 0.25π, (c) 0.75π, and (d) π

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Figure 7

Temperature contours during one periodic cycle at ωt*= (a) 0, (b) 0.25π, (c) 0.75π, and (d) π

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Figure 8

Average temperature ratio of the (a) first, (b) second, and (c) third chips during one periodic cycle for different Reynolds numbers, and f=1/5000

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Figure 9

Average Nusselt ratio of the (a) first, (b) second, and (c) third chips during one periodic cycle for different Reynolds numbers, and f=1/5000

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Figure 10

The effect of frequency on (a) average temperature ratio, and (b) the average Nusselt ratio of the three chips during one periodic cycle for Re=500

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Figure 11

The pressure drop ratio across the channel for different (a) Reynolds numbers, (b) frequencies, and (c) cyclic average

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Figure 12

The effect of frequency on the average temperature of the three chips during one periodic cycle for ui=0.15 m/s

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