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THERMAL ISSUES IN EMERGING TECHNOLOGIES THEORY AND APPLICATIONS, THETA

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

[+] Author and Article Information
Wataru Nakayama

 ThermTech International, 920-7 Higashi Kosio, Oh-Iso, Kanagawa 255-0004, Japanwatnakayama@aol.com

J. Electron. Packag 130(4), 041108 (Nov 14, 2008) (6 pages) doi:10.1115/1.2993137 History: Received September 18, 2007; Revised April 09, 2008; Published November 14, 2008

This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat sources to the heat sink. The objective of thickness distribution design is to reduce the variation among heat source temperatures and the maximum heat source temperature simultaneously. The genetic algorithm is used to search for an optimum thickness distribution. The problem is a generic representation of the situations that are becoming common in a compact electronic equipment.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Concept of heat conduction panel

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Figure 2

Model of heat conduction panel composed of a base plate and tiles

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Figure 3

Tile layout on an example panel: (a) a plan with fixed tiles and (b) a plan having three movable tiles occupying seats 2, 9, and 10

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Figure 4

Template organizations and their calculated data of the first and third generations

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Figure 5

Third generation templates and the tile layout of the fittest

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Figure 6

Isotherms on the first randomly selected template and the fittest template in the third generation: (a) isotherms on template 1 of the first generation and (b) isotherms on template 3 of the third generation

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Figure 7

Comparison of the flat panel performance with that of the panel having the optimum tile layout

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