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THERMAL ISSUES IN EMERGING TECHNOLOGIES THEORY AND APPLICATIONS, THETA

Compact Thermal Models: A Global Approach

[+] Author and Article Information
Mohamed-Nabil Sabry

Center for R&D and International Cooperation, French University in Egypt, 10 Hadaeq Ramo, Tariq ElNasr, Medinet Nasr, Cairo 11371, Egypt

Hossam Saleh Abdelmeguid1

Mechanical Engineering Department, Mansoura University, Mansoura, Egypt

1

Present address: Water Software Systems, School of Engineering and Technology, De Montfort University, Queen's Building (Q0.02), The Gateway, Leicester, LE1 9BH, UK.

J. Electron. Packag 130(4), 041107 (Nov 14, 2008) (6 pages) doi:10.1115/1.2993132 History: Received September 28, 2007; Revised August 17, 2008; Published November 14, 2008

The construction and usage of compact thermal models (CTMs), for the thermal analysis as well as the design of cooling devices for electronic systems, are reviewed. These models have many advantages over the so called detailed models based on 3D simulations, mainly being a convenient and simple quantitative description of the modeled object, when constructional details are either unavailable or too detailed to be of use at the desired level of analysis. However, CTMs have manifested some deficiencies in many cases, in particular, multiple chip modules (MCM) and stacked dies. The opposite approach, detailed modeling, is more reliable, although extremely heavy. A new approach is proposed that solves this dilemma by bridging the gap between compact and detailed models. While retaining all advantages of CTMs, i.e., having a limited number of degrees of freedom and not requiring detailed constructional features, it can attain any required precision level depending on the degree of complexity adopted. It gives reliable results covering all operating conditions including MCM and stacked dies. Moreover, it gives access to data on surface temperature gradients that were never obtained before by compact models and are highly important for reliability issues.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Ball grid array (BGA) constructional details

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Figure 2

Temperature predictions T versus r (the distance along diagonal) of flexible profile applied to the BGA problem (test case 15) for the zeroth (M0), second (M2), and fourth order (M4) approximations

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Figure 3

Test case 44 for the BGA package proposed in the benchmark (26)

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Figure 4

Test case 01 for the BGA package proposed in the benchmark (26)

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Figure 5

A hypothetical package structure to test the ability to treat MCM with general boundary conditions

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Figure 6

Results of the hypothetical package, with only the left heater energized

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Figure 7

Results of the hypothetical package, with only the right heater energized

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