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Research Papers

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

[+] Author and Article Information
Saketh Mahalingam

 General Electric Global Research Center, Bangalore 560066, Indiasakethraman.mahalingam@ge.com

Ananth Prabhakumar, Sandeep Tonapi

 General Electric Global Research Center, Niskayuna, NY 12309

Suresh K. Sitaraman1

Computer Aided Simulation of Packaging Reliability (CASPaR) Laboratory, G. W. Woodruff School of Mechanical Engineering, Atlanta, GA 30332suresh.sitaraman@me.gatech.edu

1

Corresponding author.

J. Electron. Packag 130(4), 041005 (Nov 17, 2008) (5 pages) doi:10.1115/1.3010378 History: Received July 25, 2005; Revised March 19, 2008; Published November 17, 2008

The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In this paper, the propagation of delamination in a nanofilled no-flow underfill material from the chip passivation in flip chip assemblies has been assessed under accelerated thermal shock testing. A theoretical model of the flip chip assembly has been developed, and the delamination occurring at the silicon nitride (SiN)–underfill interface has been studied under monotonic as well as thermomechanical fatigue loading. Using empirical models for delamination propagation, the growth of delamination under monotonic as well as thermomechanical fatigue loading in a flip chip assembly has been predicted. These predictions agree well with the thermal shock cycling experimental data. The agreement between the theoretical predictions and experimental data suggests that the models and the methodology developed in this work can be used to design flip chip assemblies with nanofillled no-flow underfill materials against interfacial delamination.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Interfacial crack

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Figure 2

Flip chip test vehicle

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Figure 3

Underfill fillet cracking

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Figure 4

Delamination of the underfill-passivation interface: (a) after 1000 thermal shock cycles and (b) after 1800 thermal shock cycles

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Figure 5

Finite element model of the flip chip assembly

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Figure 6

Elastic-plastic properties of a eutectic solder

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Figure 7

Growth of delamination in the flip chip assembly

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Figure 8

SiN-underfill interfacial delamination in flip chip assemblies

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