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Research Papers

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

[+] Author and Article Information
S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung

Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY 13902

J. Electron. Packag 130(4), 041004 (Nov 17, 2008) (10 pages) doi:10.1115/1.2993146 History: Received February 06, 2007; Revised April 02, 2008; Published November 17, 2008

Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution and different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC simulation, computational fluid dynamics analysis and finite element analysis are performed. The assembly deformations in numerical simulation are compared with those obtained by Moiré images. It is confirmed that for a certain organic package PC can be a more severe condition that causes solder interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always.

Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of FC-BGA—front view and top view

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Figure 2

Schematic of the experimental setup for power cycling

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Figure 3

Power cycling—temperature and power history

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Figure 4

Accelerated thermal cycling—temperature history

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Figure 5

V-field Moiré images of FC-PBGA in ATC and PC tests

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Figure 6

U-field Moiré images and the deformation mismatch of FC-PBGA in the PC test

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Figure 7

U-field Moiré images and the deformation mismatch of FC-CBGA in the PC test

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Figure 8

Quarter symmetry model of the FC-BGA package in ANSYS

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Figure 9

U-field deformation mismatch in the PC condition

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Figure 10

U-field deformation mismatch in the ATC condition

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Figure 11

V-field deformation mismatch in the PC condition

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Figure 12

V-field deformation mismatch in the ATC condition

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Figure 13

Warpage distribution of FC-PBGA and FC-CBGA in the PC and ATC conditions

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Figure 14

Characteristic life of the solder joint of FC-PBGA

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Figure 15

Characteristic life of the solder joint of FC-CBGA

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