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Research Papers

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

[+] Author and Article Information
Jin Yang

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, MaRC Building, Room 453, Atlanta, GA 30332-0405

I. Charles Ume

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, MaRC Building, Room 453, Atlanta, GA 30332-0405charles.ume@me.gatech.edu

J. Electron. Packag 130(3), 031009 (Aug 01, 2008) (10 pages) doi:10.1115/1.2957328 History: Received August 14, 2007; Revised January 07, 2008; Published August 01, 2008

Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important to correlate the defects with dynamic responses of packaged electronic devices under pulsed laser loading. The effect of solder bump defects on the mode frequencies and mode shapes is reported in this paper. The objective is to develop a modal analysis approach, which integrates analytical, numerical, and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and transient out-of-plane displacement measurements for a 6.35×6.35×0.6mm3 PB18 flip chip mounted on a FR4 board.

Copyright © 2008 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

3D model of plate and spring system

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Figure 2

Schematic of the PB18 flip chip

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Figure 3

Schematic of the PB18 flip chips: (a) one open bump, (b) two open bumps, (c) three open bumps, and (d) four open bumps

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Figure 4

Mode shift percentage in the analytical model

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Figure 5

Mode shift percentage in the analytical model with open bumps at the center of top edge

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Figure 6

3D finite element model of the PB18 flip chip

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Figure 7

Mode shift percentage in the FE model

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Figure 8

Seven predominant mode shapes of good PB18 flip chip

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Figure 16

Mode shape evolution of Mode 2 from the FE model: (a) one open bump, (b) two open bumps, (c) three open bumps, and (d) four open bumps

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Figure 12

Excitation and detection positions

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Figure 13

Time-domain responses of Chips 1–6

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Figure 14

Power spectrum of Chips 1–6: (a) original power spectrum and (b) power spectrum ranging from 150kHzto350kHz

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Figure 15

Power spectrum ranging from 150kHzto210kHz: (a) Point 36 and (b) Point 48

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Figure 9

Mode shape evolution with increasing number of open bumps: (a) Mode 1, (b) Mode 2, (c) Mode 3, and (d) Mode 4

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Figure 10

Diagram of the laser ultrasound-interferometric inspection system

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Figure 11

Test vehicle layout

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