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Research Papers

Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys

[+] Author and Article Information
Min Pei

 Georgia Institute of Technology, 801 Ferst Drive NW, Atlanta, GA 30332-0405

Jianmin Qu

 Georgia Institute of Technology, 801 Ferst Drive NW, Atlanta, GA 30332-0405Jianmin.qu@me.gatech.edu

J. Electron. Packag 130(3), 031004 (Jul 29, 2008) (6 pages) doi:10.1115/1.2957321 History: Received May 12, 2007; Revised January 17, 2008; Published July 29, 2008

In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic region; at a much smaller length scale the eutectic region consists of submicron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of lanthanum doped SnAg solders.

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Copyright © 2008 by American Society of Mechanical Engineers
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References

Figures

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Figure 7

Stress-strain curve predicted by the FE method

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Figure 8

Result of SnAg solder under tensile loading at the horizontal direction: (a) equivalent creep strain and (b) von Mises stress

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Figure 9

Comparison of model with test result (a) SnAg solder and (b) RE doped

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Figure 10

Typical nanoindentation loading curve

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Figure 11

FEM indentation model displacement field

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Figure 1

Hierarchal microstructure

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Figure 2

Comparison of Mori–Tanaka model with nanoindentation result

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Figure 3

Mori–Tanaka model stress-strain rate: (a) SnAg and (b) SnAgLa solder

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Figure 4

Original image for digital image-based FEM model

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Figure 5

FEM mesh of digital image-based study: (a) SnAg no RE case and (b) SnAg0.25La

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Figure 6

Comparison of models at large length scale

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