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Technical Briefs

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

[+] Author and Article Information
Samson Yoon, Changsoo Jang

Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742

Bongtae Han1

Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742bthan@umd.edu

1

Corresponding author.

J. Electron. Packag 130(2), 024502 (May 14, 2008) (5 pages) doi:10.1115/1.2912181 History: Received June 03, 2007; Revised October 02, 2007; Published May 14, 2008

A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat transfer, and stress analysis routines available in the commercial FEM package, but offers a unique way of linking the routines to conduct a nonlinear stress analysis of semiconductor packages subjected to moisture as well as temperature excursions. Strategies to implement the proposed scheme using commercial finite element analysis softwares are discussed. The numerical accuracy of the scheme is confirmed with the analytical solution of elastic/viscoelastic composite cylinder subjected to the combined loading of thermal expansion and hygroscopic swelling.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Modeling hierarchy for the thermohygroscopic stress analysis

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Figure 2

Model for the numerical verification

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Figure 3

Evolution of moisture content and relaxation modulus as a function of time

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Figure 4

Stress history at the interface calculated from the analytic solution and FEM

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