Research Papers

Board Level Drop Test Analysis Based on Modal Test and Simulation

[+] Author and Article Information
Fang Liu

State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, P.R.C.fangl@sjtu.edu.cn

Guang Meng, Mei Zhao

State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, P.R.C.

Junfeng Zhao

 Intel Technology Development (Shanghai) Co., Ltd., 999 Yinglun Road, Shanghai 200131, P.R.C.

J. Electron. Packag 130(2), 021007 (May 08, 2008) (6 pages) doi:10.1115/1.2912212 History: Received March 30, 2007; Revised September 10, 2007; Published May 08, 2008

Solder joint reliability in drop test is crucial for handheld systems, such as mobile phone, digital camera, and MP3 player. In recent years, a lot of experiments and simulations have been carried out by researchers to study board level drop test, and many useful results have been obtained. Regarding mechanical simulation and analysis, there are still two challenges: How to design drop test printed circuit board (PCB) based on dynamic simulation and analysis? How to get accurate elastic modulus of PCB, especially damping parameters, as property inputs for drop test simulation? In this study, an approach based on systematic modal tests and analyses is used to address these two challenges. First, modal dynamic simulation is used to design the test board to meet drop test requirements. Second, modal tests are conducted on drop test board in order to validate dynamic simulation and measure structural damping parameters and overall board elastic modulus as well. Adopted directly in drop test simulation, the measured damping parameters and elastic modulus are proved to be accurate. It is verified through comparison between the finite element simulation and real drop test results. With the modal tests and simulation method established here, drop simulation becomes very simple and accurate, and test board design and characterization are also simplified. Thus, considerable drop test experiment and simulation fine tune, and validation work can be saved.

Copyright © 2008 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Figure 1

Round test board

Grahic Jump Location
Figure 2

Location of measurement points

Grahic Jump Location
Figure 4

Block diagram for modal testing system

Grahic Jump Location
Figure 5

Free boundary condition

Grahic Jump Location
Figure 6

The first mode of PCB under free boundary condition: (a) modal test and (b) FEA

Grahic Jump Location
Figure 7

Schematic of input-G method

Grahic Jump Location
Figure 8

Finite element model of PCBA

Grahic Jump Location
Figure 9

The first mode of PCBA fixed with eight bolts: (a) modal test and (b) FEA

Grahic Jump Location
Figure 10

Block diagram for drop test system

Grahic Jump Location
Figure 11

Acceleration response spectrum

Grahic Jump Location
Figure 12

Strain spectrum

Grahic Jump Location
Figure 13

Comparison of strain (circumference) curves

Grahic Jump Location
Figure 14

The center acceleration response of round PCBA




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In