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Research Papers

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

[+] Author and Article Information
Melida Chin1

Department of Mechanical Engineering, The University of Michigan, 2250 G. G. Brown, 2350 Hayward Street, Ann Arbor, MI 48109-2125

S. Jack Hu2

Department of Mechanical Engineering, The University of Michigan, 2250 G. G. Brown, 2350 Hayward Street, Ann Arbor, MI 48109-2125jackhu@umich.edu

James R. Barber

Department of Mechanical Engineering, The University of Michigan, 2250 G. G. Brown, 2350 Hayward Street, Ann Arbor, MI 48109-2125

1

Present address: Advanced Micro Devices, 1 AMD Place, Sunnyvale, CA 94085.

2

Corresponding author.

J. Electron. Packag 130(2), 021006 (May 08, 2008) (3 pages) doi:10.1115/1.2912180 History: Received January 17, 2006; Revised September 09, 2007; Published May 08, 2008

Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important parameters include initial bonding force F, number of particles N, the adhesion strength GA, and modulus of elasticity E of the cured resin. It is well known that as the bonding force increases, the contact resistance decreases. However, when the bonding force reaches a certain maximum value, the contact between conductive particle and conductive track is disrupted due to delamination of the cured resin during the elastic recovery. The authors have shown in previous studies that the delamination is caused by high residual stresses and that it largely depends on the adhesion strength of the assembly and on the modulus of elasticity of the cured resin. Additionally, the authors have provided a methodology to quantify the maximum threshold value of the bonding force for different numbers of particles trapped between mating conductive tracks. In this paper, the relationships between contact resistance R and each one of these parameters are systematically investigated to create diagrams that give regions of robust design. Given the number of particles and their size, adhesion strength, and modulus of elasticity of the resin, the required bonding force can be found in order to achieve a desired range in contact resistance.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

Grahic Jump Location
Figure 1

Interrelationship between modulus of elasticity E, adhesion strength GA, and initial bonding force F for the single particle case

Grahic Jump Location
Figure 2

Interrelationship between modulus of elasticity E, adhesion strength GA, and number of particles N for an initial bonding force of 20mN and multiple particles

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