Research Papers

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

[+] Author and Article Information
K. Lafdi1

 University of Dayton, 300 College Park, Dayton, OH 45469lafdi@udri.udayton.edu

O. Mesalhy

 University of Dayton, 300 College Park, Dayton, OH 45469

A. Elgafy

MET Department, College of Applied Science, University of Cincinnati, Cincinnati, OH, 45206


Corresponding author.

J. Electron. Packag 130(2), 021004 (Apr 25, 2008) (8 pages) doi:10.1115/1.2912185 History: Received February 18, 2007; Revised November 12, 2007; Published April 25, 2008

In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different design parameters have been investigated such as foam properties (porosity, pore size, and thermal conductivity), heat sink shape, orientation, and use of internal fins inside the foam-PCM composite. Due to huge difference in thermal properties between the PCM and the solid matrix, two energy equation model has been adopted to solve the energy conservation equations. This model can handle local thermal nonequilibrium condition between the PCM and the solid matrix. The numerical model is based on volume averaging technique, and the finite volume method is used to discretize the heat diffusion equation. The findings show that, for steady heat generation, the shape and orientation of the composite heat sink have significant impact on the system performance. Conversely, in the case of power spike input, use of a PCM with low melting point and high latent heat is more efficient.

Copyright © 2008 by American Society of Mechanical Engineers
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Figure 9

Maximum junction temperature for using fins

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Figure 10

PCM phase temperature contours for different angles (80deg and 70deg)

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Figure 11

PCM phase temperature contours for bottom heating

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Figure 12

PCM phase temperature contours for top heating

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Figure 13

Maximum junction temperature for different shapes and orientations

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Figure 14

Heat flux at the left side for fluctuating energy

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Figure 15

Maximum junction temperature for different latent heats

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Figure 16

Maximum junction temperature for different melting temperatures

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Figure 1

(a) Solid-liquid interface after 10min: comparison between present model and predicted results given in Ref. 21; (b) snapshots for liquid-solid interface at time=75min for different porosity aluminum foams infiltrated with PCM, Ref. 22; and (c) comparison between present numerical findings and experimental findings presented in Ref. 22 for solid-liquid interface for aluminum foam 10 PPI, 93.4% porosity at different time levels

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Figure 2

Physical domain of the heat sink

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Figure 3

PCM and solid phase temperature contours: continuous (solid) and dotted (PCM)

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Figure 4

Temperature-time history at different points in the junction for Al foam (porosity=94% and pore size=10 PPI)

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Figure 5

Maximum junction temperature for different foam porosities

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Figure 6

Maximum junction temperature for different foam pore sizes

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Figure 7

Maximum junction temperature for different interfacial heat transfer coefficients

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Figure 8

PCM temperature contours for a heat sink supported with one and two fins




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