Research Papers

A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

[+] Author and Article Information
D. Bhate, D. Chan

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088

G. Subbarayan

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088ganeshs@purdue.edu

L. Nguyen

 National Semiconductor Corporation, Santa Clara, CA 95051

J. Electron. Packag 130(2), 021003 (Apr 15, 2008) (9 pages) doi:10.1115/1.2840057 History: Received January 05, 2007; Revised August 20, 2007; Published April 15, 2008

Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn–Pb solder alloys together with empirical fatigue life models such as the Coffin–Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn–Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection. The model is shown to be similar to well accepted cohesive zone models in its theoretical development and application and is anticipated to be computationally more efficient compared to cohesive zone models in a finite element setting. The approach goes beyond empirical modeling in accurately predicting crack trajectories and is validated against experiments performed on lead-free as well as Sn–Pb solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique.

Copyright © 2008 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Figure 1

Different methods of incorporating irreversibility into the cohesive law: (a) unloading-reloading to and from origin (17), (b) unloading to origin, hysteretic reloading (18), and (c) variable slope unloading-reloading (19)

Grahic Jump Location
Figure 2

Typical form of the Weibull PDF (left) and the traction-separation law derived from the Smith–Ferrante law (right). The forms are clearly very similar.

Grahic Jump Location
Figure 3

Damage accumulation as a function of elongation ratio (18)

Grahic Jump Location
Figure 4

(a) Test specimen dimensions; inset shows cross section of the solder joint. (b) Crack fronts obtained as a result of thermomechanical fatigue imposed on solder joints, followed by red dye penetration. Results shown for (from left to right) 411, 621 and 807 10mincycles between 0°C and 100°C. The images were processed and crack fronts measured using SCION IMAGE (26). The circles are approximations to the experimentally observed crack fronts (all dimensions in millimeters).

Grahic Jump Location
Figure 5

Thermocouple measurements for top (exposed to ambient) and bottom (in contact with Peltier device) of specimen. These profiles were used as isothermal boundary conditions in simulation.

Grahic Jump Location
Figure 6

Finite element model of a quarter of the specimen assembly and the refined mesh of the solder joint

Grahic Jump Location
Figure 7

Plots of the evolution of (a) inelastic strains and (b) damage ahead of the crack tip over seven simulated fatigue cycles

Grahic Jump Location
Figure 8

Comparison of experimentally observed and numerically predicted crack fronts

Grahic Jump Location
Figure 9

Comparison of experimentally observed and numerically predicted crack fronts for different fatigue cycles. The white squares correspond to the first set of intact tie constraints ahead of the crack front. The red dye corresponds to the cracked area.

Grahic Jump Location
Figure 10

Crack growth as a function of number of cycles showing a bilinear rate of growth with a transition in rate at normalized crack length of approximately 0.7

Grahic Jump Location
Figure 11

The hybrid model shows excellent correlation between crack fronts observed experimentally and tracked via simulations (reproduced from Ref. 15)

Grahic Jump Location
Figure 12

The computed rate of damage change for a crack locus along the centerline of the solder interconnection (15); the change in the rate of damage change from linear to exponential occurred at a normalized crack length of approximately 0.7 and corresponded to a change in fracture morphology from creep fatigue to shear overload (28)




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In