Research Papers

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

[+] Author and Article Information
Mark A. Trautman

 Intel Corporation, 2111 NE 25th Avenue, Hillsboro, OR 97124mark.a.trautman@intel.com

Murli Tirumala

 Intel Corporation, 2111 NE 25th Avenue, Hillsboro, OR 97124murli.tirumala@intel.com

S. M. You

Department of Mechanical and Aerospace Engineering, The University of Texas at Arlington, Arlington, TX 76019-0023you@uta.edu

J. Electron. Packag 130(1), 011007 (Feb 04, 2008) (6 pages) doi:10.1115/1.2837509 History: Received January 04, 2006; Revised August 31, 2007; Published February 04, 2008

An empirical study of pool nucleate boiling enhanced with a microporous coating was conducted within the context of microprocessor cooling. A thermal test vehicle (TTV) emulated the heat load from a general purpose microprocessor and delivered a moderately nonuniform heat flux density distribution at the boiling surface that would be typical of mainstream microprocessors. The TTV was affixed to a copper test coupon that formed the bottom surface of a sealed boiling chamber containing FC-72 at atmospheric pressure. A design of experiments was conducted on multiple test coupons to identify how the microporous coating, the base thickness of the coupon, and the height of small pin fins affect the combined conduction and boiling heat transfer from the test coupon. The data revealed that the presence of the microporous coating was the most significant factor of the three tested and indicates that the presence of fins as short as 0.5mm may play a role in reducing hysteresis in the boiling curve.

Copyright © 2008 by American Society of Mechanical Engineers
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Figure 1

Schematic of the evaporator test coupon, power source, and base thermocouple installation

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Figure 2

Schematic of the test apparatus; block arrows indicate the heat flow path

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Figure 3

The TTV package utilized as the microprocessor heat source

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Figure 4

Copper evaporator test coupon and site window as installed on the test board (condenser not shown)

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Figure 5

SEM images of the surface finish of ((a) and (b)) a flat machined surface; ((c) and (d)) a pin fin machined surface; (e) a ABM coating applied to a flat surface

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Figure 6

The evaporator thermal resistance and the DOE parameters: microporous coating, evaporator base thickness, and fin height

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Figure 7

Hysteresis of a flat coated surface: Sample 8

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Figure 8

Photograph of an evaporator coupon with 1mm pin fin array treated with ABM coating

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Figure 9

Hysteresis of a double enhanced surface: Sample 6




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