Research Papers

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

[+] Author and Article Information
Yung-Shin Tseng, Bau-Shei Pei

Department of Engineering and System Science,  National Tsing Hua University, Taiwan, R.O.C.

Tzu-Chen Hung1

Department of Mechanical and Automation Engineering, I-Shou University, Section 1, Hsueh-Cheng Road, Ta-Hsu Hsiang, Kaohsiung County, Taiwan, 840, R.O.C.tchung@isu.edu.tw


Corresponding author.

J. Electron. Packag 130(1), 011006 (Jan 31, 2008) (8 pages) doi:10.1115/1.2837524 History: Received January 19, 2007; Revised June 07, 2007; Published January 31, 2008

In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary layer on substrate surfaces and hence improve the cooling ability of a module without any additional active parts. Furthermore, the concept of openings has not only so far provided at least 12% improvement in heat transfer, but also reduced some difficulties in finding thermal solution, such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect.

Copyright © 2008 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Figure 1

Illustration of experimental apparatus: (a) the environment control apparatus and (b) the test module constitution

Grahic Jump Location
Figure 2

Temperature distribution of PCB: (a) CFD results and (b) the normalized temperature distribution along Ri

Grahic Jump Location
Figure 3

Validation of the DO model with theoretical values

Grahic Jump Location
Figure 4

Comparison between experimental measurements and CFD simulation

Grahic Jump Location
Figure 5

Trend of thermal resistance with respect to various power levels

Grahic Jump Location
Figure 6

Flow field distribution under several situations at the plane Z=0: (a) temperature distribution for PCB without opening, (b) temperature distribution for PCB with opening, and (c) velocity-magnitude distribution

Grahic Jump Location
Figure 7

Thermal resistance trends of nonaperture PCB under two orientations

Grahic Jump Location
Figure 8

CFD results for pressure difference between both channels as Hi=0.5 and without opening to PCB

Grahic Jump Location
Figure 9

Thermal resistance distribution of several opening locations: (a) Ri=1.0, (b) Ri=1.5, and (c) Ri=2.0

Grahic Jump Location
Figure 10

Distribution of the local Nusselt number on the plane Z=0 for the combination of Ri=2.0, Di=0.3, Hi=0.5, and N=8: substrate without opening (left hand side) and substrate with opening (right hand side)

Grahic Jump Location
Figure 11

Trend of thermal resistance for situation of N=8, Di=0.3, and downward orientation of chip

Grahic Jump Location
Figure 12

Variation of relative cooling ability with respect to Hi for the modification of aperture geometry




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In