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Research Papers

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

[+] Author and Article Information
Yung-Shin Tseng, Bau-Shei Pei

Department of Engineering and System Science,  National Tsing Hua University, Taiwan, R.O.C.

Tzu-Chen Hung1

Department of Mechanical and Automation Engineering, I-Shou University, Section 1, Hsueh-Cheng Road, Ta-Hsu Hsiang, Kaohsiung County, Taiwan, 840, R.O.C.tchung@isu.edu.tw

1

Corresponding author.

J. Electron. Packag 130(1), 011006 (Jan 31, 2008) (8 pages) doi:10.1115/1.2837524 History: Received January 19, 2007; Revised June 07, 2007; Published January 31, 2008

In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary layer on substrate surfaces and hence improve the cooling ability of a module without any additional active parts. Furthermore, the concept of openings has not only so far provided at least 12% improvement in heat transfer, but also reduced some difficulties in finding thermal solution, such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Illustration of experimental apparatus: (a) the environment control apparatus and (b) the test module constitution

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Figure 2

Temperature distribution of PCB: (a) CFD results and (b) the normalized temperature distribution along Ri

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Figure 3

Validation of the DO model with theoretical values

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Figure 4

Comparison between experimental measurements and CFD simulation

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Figure 5

Trend of thermal resistance with respect to various power levels

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Figure 6

Flow field distribution under several situations at the plane Z=0: (a) temperature distribution for PCB without opening, (b) temperature distribution for PCB with opening, and (c) velocity-magnitude distribution

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Figure 7

Thermal resistance trends of nonaperture PCB under two orientations

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Figure 8

CFD results for pressure difference between both channels as Hi=0.5 and without opening to PCB

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Figure 9

Thermal resistance distribution of several opening locations: (a) Ri=1.0, (b) Ri=1.5, and (c) Ri=2.0

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Figure 10

Distribution of the local Nusselt number on the plane Z=0 for the combination of Ri=2.0, Di=0.3, Hi=0.5, and N=8: substrate without opening (left hand side) and substrate with opening (right hand side)

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Figure 11

Trend of thermal resistance for situation of N=8, Di=0.3, and downward orientation of chip

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Figure 12

Variation of relative cooling ability with respect to Hi for the modification of aperture geometry

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