Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array

[+] Author and Article Information
Gaowei Xu

 Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, Chinaxugw@mail.sim.ac.cn

Yingjun Cheng, Le Luo

 Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China

J. Electron. Packag 129(4), 518-521 (Mar 05, 2007) (4 pages) doi:10.1115/1.2804102 History: Received June 09, 2006; Revised March 05, 2007

The heat-transfer characteristics of 128 small-sized plate-fin heat sinks in a supercomputer chassis are investigated with CFD simulation. The V-shaped curves of the chip temperature versus fin pitch and fin thickness are derived and a thermal resistance model is built to explore the profile and obtain the convective heat-transfer coefficient of the heat sinks. It turns out that the V-shaped profile arises from the joint action of the thermal conduction and convection of heat sink, which can be attributed to the intricacy of the dependencies of thermal resistances on either fin pitch or thickness. It can be further concluded that Biot criterion is applicable to estimate the Biot number of large-scale plate-fin heat sink but not applicable for the small-sized one. The convective heat-transfer coefficient is a complicated function of fin pitch and fin thickness. The empirical formulas of heat transfer are obtained and the fin pitch and fin thickness are optimized.

Copyright © 2007 by American Society of Mechanical Engineers
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Figure 1

(a) Side view and (b) top view of chassis model (chips are under the heat sinks)

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Figure 2

Schematic of a plate-fin heat sink

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Figure 3

(a) Tmax versus fin-pitch curves; (b) Tmax versus fin-thickness curves

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Figure 4

Dependencies of total thermal resistance on (a) fin pitch (b) fin thickness

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Figure 5

Convective coefficient of heat sink versus (a) fin-pitch (b) fin-thickness by CFD simulation




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