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Journal of Electronic Packaging | Volume 129 | Issue 4 | Technical Brief
TECHNICAL BRIEFS

An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques

[+] Author and Article Information
Thomas E. Salem1

Department of Electrical Engineering, U.S. Naval Academy, 105 Maryland Avenue, Annapolis, MD 21402salem@usna.edu

Stephen B. Bayne, Don Porschet

 U.S. Army Research Laboratory, 2800 Powder Mill Road, Adelphi, MD 20783-1197

1

Corresponding author.

J. Electron. Packag 129(4), 512-517 (Feb 13, 2007) (6 pages) doi:10.1115/1.2814056 History: Received March 13, 2006; Revised February 13, 2007
Article
References
Figures

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a metal-oxide-semiconductor field-effect transistor on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique using Fourier analysis techniques for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.
Copyright © 2007 by American Society of Mechanical Engineers
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References

1
Simons, R. E., 1994, “Microelectronics Cooling and Semitherm: A Look Back,” "Proceedings Tenth IEEE SEMI-THERM Symposium", pp. 1–16.
2
Lall, B. S., 1998, “Concurrent Thermal Design for High-Power Electronics,” "Proceedings 14th IEEE SEMI-THERM Symposium", pp. 95–103.
3
Kim, C. K., and Nho, K. M., 1998, “Heatsink Design of High Power Converter,” "IEEE Power Electronics Specialist Conference", Vol. 2 , pp. 2122–2130.
4
Lee, S., 1995, “Optimum Design and Selection of Heat Sinks,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A  [CrossRef], 18 (4), pp. 812–817.
5
Shaukatullah, H., 1998, “Bibliography of Air Cooled Heat Sinks for Thermal Enhancement of Electronic Packages,” "Proceedings 14th IEEE SEMI-THERM Symposium", pp. 181–221.
6
Shaukatullah, H., 1999, “Bibliography of Liquid Cooled Heat Sinks for Thermal Enhancement of Electronic Packages,” "Proceedings 15th IEEE SEMI-THERM Symposium", pp. 231–245.
7
Fatemizadeh, B., Tchouangue, G., and Silber, D., 1996, “A User-Optimized Electro-Thermal IGBT Model for Power Electronic Circuit Simulation in the Circuit Simulator ELDO,” "Proceedings 11th IEEE Applied Power Electronics Conference and Exposition", Vol. 1 , pp. 81–87.
8
Kang, X., Caiafa, A., Santi, E., Hudgins, J., and Palmer, P. R., 2002, “Low Temperature Characterization and Modeling of IGBTs,” "IEEE Power Electronics Specialists Conference", Vol. 3 , pp. 1277–1282.
9
Yun, C. S., Malberti, P., Ciappa, M., and Fichtner, W., 2001, “Thermal Component Model for Electrothermal Analysis of IGBT Module Systems,” IEEE Trans. Adv. Packag.  [CrossRef], 24 (3), pp. 401–406.
10
http://www.infineon.com
11
Marz, M., and Nance, P., “Thermal Modeling of Power-electronic Systems,” Available on the Infineon Web site at http://www.infineon.com//upload/Document/mmpn_eng.pdf.
12
Nelson, J. J., Venkataramanan, G., and El-Refaie, A. M., 2003, “Fast Thermal Profiling of Power Semiconductor Devices Using Fourier Techniques,” "IEEE Applied Power Electronics Conference", Vol. 2 , pp. 1023–1028.
13
Katsis, D. C., and van Wyk, J. D., 2001, “Void Induced Thermal Impedance in Power Semiconductor Modules: Some Transient Temperature Effects,” "IEEE IAS Conference", pp. 1905–1991.

Figures

Grahic Jump Location
+Electrical model of thermal dynamics
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Electrical model of thermal dynamics
Figure 1

Electrical model of thermal dynamics

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+(a) Water-cooled heat sink system; (b) unmodified Thermshield TS-541123-HF
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(a) Water-cooled heat sink system; (b) unmodified Thermshield TS-541123-HF
Figure 2

(a) Water-cooled heat sink system; (b) unmodified Thermshield TS-541123-HF

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+Constant power load circuit
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Constant power load circuit
Figure 3

Constant power load circuit

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+Thermal resistance as a function of flow rate
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Thermal resistance as a function of flow rate
Figure 4

Thermal resistance as a function of flow rate

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+Experimental results for a 100mHz200W thermal load applied to the pole-array heat sink
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Experimental results for a 100mHz200W thermal load applied to the pole-array heat sink
Figure 5

Experimental results for a 100mHz200W thermal load applied to the pole-array heat sink

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+PSPICE simulation results for a 100mHz200W thermal load applied to the pole-array heat sink
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PSPICE simulation results for a 100mHz200W thermal load applied to the pole-array heat sink
Figure 6

PSPICE simulation results for a 100mHz200W thermal load applied to the pole-array heat sink

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+Thermal transient performance for the pole-array heat sink
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Thermal transient performance for the pole-array heat sink
Figure 7

Thermal transient performance for the pole-array heat sink

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+Modified Thermshield heat sink and water manifold insert block
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Modified Thermshield heat sink and water manifold insert block
Figure 8

Modified Thermshield heat sink and water manifold insert block

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+Experimental thermal resistance data for modified and unmodified pole-array heat sink
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Experimental thermal resistance data for modified and unmodified pole-array heat sink
Figure 9

Experimental thermal resistance data for modified and unmodified pole-array heat sink

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+Transient performance of the modified pole-array heat sink
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Transient performance of the modified pole-array heat sink
Figure 10

Transient performance of the modified pole-array heat sink

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+(a) Microchannel heat sink, thermal insulating block, and water manifold; (b) TO-220 part ready for clamping block and use
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(a) Microchannel heat sink, thermal insulating block, and water manifold; (b) TO-220 part ready for clamping block and use
Figure 11

(a) Microchannel heat sink, thermal insulating block, and water manifold; (b) TO-220 part ready for clamping block and use

Grahic Jump Location
+Thermal resistance for microchannel and pole-array heat sink systems as a function of flow rate
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Thermal resistance for microchannel and pole-array heat sink systems as a function of flow rate
Figure 12

Thermal resistance for microchannel and pole-array heat sink systems as a function of flow rate

Grahic Jump Location
+Experimental results for a 100mHz200W thermal load applied to the microchannel heat sink
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Experimental results for a 100mHz200W thermal load applied to the microchannel heat sink
Figure 13

Experimental results for a 100mHz200W thermal load applied to the microchannel heat sink

Grahic Jump Location
+Simulation results for a 100mHz200W thermal load applied to the microchannel heat sink
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Simulation results for a 100mHz200W thermal load applied to the microchannel heat sink
Figure 14

Simulation results for a 100mHz200W thermal load applied to the microchannel heat sink

Grahic Jump Location
+Transient performance of the microchannel heat sink
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Transient performance of the microchannel heat sink
Figure 15

Transient performance of the microchannel heat sink

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