0
Journal of Electronic Packaging | Volume 129 | Issue 4 | Technical Brief
TECHNICAL BRIEFS

An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques

[+] Author and Article Information
Thomas E. Salem1

Department of Electrical Engineering, U.S. Naval Academy, 105 Maryland Avenue, Annapolis, MD 21402salem@usna.edu

Stephen B. Bayne, Don Porschet

 U.S. Army Research Laboratory, 2800 Powder Mill Road, Adelphi, MD 20783-1197

1

Corresponding author.

J. Electron. Packag 129(4), 512-517 (Feb 13, 2007) (6 pages) doi:10.1115/1.2814056 History: Received March 13, 2006; Revised February 13, 2007
Article
References
Figures

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a metal-oxide-semiconductor field-effect transistor on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique using Fourier analysis techniques for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.
Copyright © 2007 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

1
Simons, R. E., 1994, “Microelectronics Cooling and Semitherm: A Look Back,” "Proceedings Tenth IEEE SEMI-THERM Symposium", pp. 1–16.
2
Lall, B. S., 1998, “Concurrent Thermal Design for High-Power Electronics,” "Proceedings 14th IEEE SEMI-THERM Symposium", pp. 95–103.
3
Kim, C. K., and Nho, K. M., 1998, “Heatsink Design of High Power Converter,” "IEEE Power Electronics Specialist Conference", Vol. 2 , pp. 2122–2130.
4
Lee, S., 1995, “Optimum Design and Selection of Heat Sinks,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A  [CrossRef], 18 (4), pp. 812–817.
5
Shaukatullah, H., 1998, “Bibliography of Air Cooled Heat Sinks for Thermal Enhancement of Electronic Packages,” "Proceedings 14th IEEE SEMI-THERM Symposium", pp. 181–221.
6
Shaukatullah, H., 1999, “Bibliography of Liquid Cooled Heat Sinks for Thermal Enhancement of Electronic Packages,” "Proceedings 15th IEEE SEMI-THERM Symposium", pp. 231–245.
7
Fatemizadeh, B., Tchouangue, G., and Silber, D., 1996, “A User-Optimized Electro-Thermal IGBT Model for Power Electronic Circuit Simulation in the Circuit Simulator ELDO,” "Proceedings 11th IEEE Applied Power Electronics Conference and Exposition", Vol. 1 , pp. 81–87.
8
Kang, X., Caiafa, A., Santi, E., Hudgins, J., and Palmer, P. R., 2002, “Low Temperature Characterization and Modeling of IGBTs,” "IEEE Power Electronics Specialists Conference", Vol. 3 , pp. 1277–1282.
9
Yun, C. S., Malberti, P., Ciappa, M., and Fichtner, W., 2001, “Thermal Component Model for Electrothermal Analysis of IGBT Module Systems,” IEEE Trans. Adv. Packag.  [CrossRef], 24 (3), pp. 401–406.
10
http://www.infineon.com
11
Marz, M., and Nance, P., “Thermal Modeling of Power-electronic Systems,” Available on the Infineon Web site at http://www.infineon.com//upload/Document/mmpn_eng.pdf.
12
Nelson, J. J., Venkataramanan, G., and El-Refaie, A. M., 2003, “Fast Thermal Profiling of Power Semiconductor Devices Using Fourier Techniques,” "IEEE Applied Power Electronics Conference", Vol. 2 , pp. 1023–1028.
13
Katsis, D. C., and van Wyk, J. D., 2001, “Void Induced Thermal Impedance in Power Semiconductor Modules: Some Transient Temperature Effects,” "IEEE IAS Conference", pp. 1905–1991.

Figures

Grahic Jump Location
+Electrical model of thermal dynamics
View Large  |  Save Figure  |  Download Slide (.ppt)
Electrical model of thermal dynamics
Figure 1

Electrical model of thermal dynamics

Grahic Jump Location
+(a) Water-cooled heat sink system; (b) unmodified Thermshield TS-541123-HF
View Large  |  Save Figure  |  Download Slide (.ppt)
(a) Water-cooled heat sink system; (b) unmodified Thermshield TS-541123-HF
Figure 2

(a) Water-cooled heat sink system; (b) unmodified Thermshield TS-541123-HF

Grahic Jump Location
+Constant power load circuit
View Large  |  Save Figure  |  Download Slide (.ppt)
Constant power load circuit
Figure 3

Constant power load circuit

Grahic Jump Location
+Thermal resistance as a function of flow rate
View Large  |  Save Figure  |  Download Slide (.ppt)
Thermal resistance as a function of flow rate
Figure 4

Thermal resistance as a function of flow rate

Grahic Jump Location
+Experimental results for a 100mHz200W thermal load applied to the pole-array heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
Experimental results for a 100mHz200W thermal load applied to the pole-array heat sink
Figure 5

Experimental results for a 100mHz200W thermal load applied to the pole-array heat sink

Grahic Jump Location
+PSPICE simulation results for a 100mHz200W thermal load applied to the pole-array heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
PSPICE simulation results for a 100mHz200W thermal load applied to the pole-array heat sink
Figure 6

PSPICE simulation results for a 100mHz200W thermal load applied to the pole-array heat sink

Grahic Jump Location
+Thermal transient performance for the pole-array heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
Thermal transient performance for the pole-array heat sink
Figure 7

Thermal transient performance for the pole-array heat sink

Grahic Jump Location
+Modified Thermshield heat sink and water manifold insert block
View Large  |  Save Figure  |  Download Slide (.ppt)
Modified Thermshield heat sink and water manifold insert block
Figure 8

Modified Thermshield heat sink and water manifold insert block

Grahic Jump Location
+Experimental thermal resistance data for modified and unmodified pole-array heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
Experimental thermal resistance data for modified and unmodified pole-array heat sink
Figure 9

Experimental thermal resistance data for modified and unmodified pole-array heat sink

Grahic Jump Location
+Transient performance of the modified pole-array heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
Transient performance of the modified pole-array heat sink
Figure 10

Transient performance of the modified pole-array heat sink

Grahic Jump Location
+(a) Microchannel heat sink, thermal insulating block, and water manifold; (b) TO-220 part ready for clamping block and use
View Large  |  Save Figure  |  Download Slide (.ppt)
(a) Microchannel heat sink, thermal insulating block, and water manifold; (b) TO-220 part ready for clamping block and use
Figure 11

(a) Microchannel heat sink, thermal insulating block, and water manifold; (b) TO-220 part ready for clamping block and use

Grahic Jump Location
+Thermal resistance for microchannel and pole-array heat sink systems as a function of flow rate
View Large  |  Save Figure  |  Download Slide (.ppt)
Thermal resistance for microchannel and pole-array heat sink systems as a function of flow rate
Figure 12

Thermal resistance for microchannel and pole-array heat sink systems as a function of flow rate

Grahic Jump Location
+Experimental results for a 100mHz200W thermal load applied to the microchannel heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
Experimental results for a 100mHz200W thermal load applied to the microchannel heat sink
Figure 13

Experimental results for a 100mHz200W thermal load applied to the microchannel heat sink

Grahic Jump Location
+Simulation results for a 100mHz200W thermal load applied to the microchannel heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
Simulation results for a 100mHz200W thermal load applied to the microchannel heat sink
Figure 14

Simulation results for a 100mHz200W thermal load applied to the microchannel heat sink

Grahic Jump Location
+Transient performance of the microchannel heat sink
View Large  |  Save Figure  |  Download Slide (.ppt)
Transient performance of the microchannel heat sink
Figure 15

Transient performance of the microchannel heat sink

Tables

Errata

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
External Events PSA for Ringhals 2 PWR (PSAM-0159)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)
Introduction
Consensus on Operating Practices for the Sampling and Monitoring of Feedwater and Boiler Water Chemistry in Modern Industrial Boilers (CRTD-81)> Chapter 1
Scope
Consensus on Operating Practices for the Sampling and Monitoring of Feedwater and Boiler Water Chemistry in Modern Industrial Boilers (CRTD-81)> Chapter 2
Importance of Effective Monitoring
Consensus on Operating Practices for the Sampling and Monitoring of Feedwater and Boiler Water Chemistry in Modern Industrial Boilers (CRTD-81)> Chapter 3
Introduction
Heat Transfer & Hydraulic Resistance at Supercritical Pressures in Power Engineering Applications> Chapter 1
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
This site uses cookies. By continuing to use our website, you are agreeing to our privacy policy. | Accept
Sign In