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TECHNICAL BRIEFS

An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques

[+] Author and Article Information
Thomas E. Salem1

Department of Electrical Engineering, U.S. Naval Academy, 105 Maryland Avenue, Annapolis, MD 21402salem@usna.edu

Stephen B. Bayne, Don Porschet

 U.S. Army Research Laboratory, 2800 Powder Mill Road, Adelphi, MD 20783-1197

1

Corresponding author.

J. Electron. Packag 129(4), 512-517 (Feb 13, 2007) (6 pages) doi:10.1115/1.2814056 History: Received March 13, 2006; Revised February 13, 2007

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a metal-oxide-semiconductor field-effect transistor on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique using Fourier analysis techniques for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

Electrical model of thermal dynamics

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Figure 2

(a) Water-cooled heat sink system; (b) unmodified Thermshield TS-541123-HF

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Figure 3

Constant power load circuit

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Figure 4

Thermal resistance as a function of flow rate

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Figure 5

Experimental results for a 100mHz200W thermal load applied to the pole-array heat sink

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Figure 6

PSPICE simulation results for a 100mHz200W thermal load applied to the pole-array heat sink

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Figure 7

Thermal transient performance for the pole-array heat sink

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Figure 8

Modified Thermshield heat sink and water manifold insert block

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Figure 9

Experimental thermal resistance data for modified and unmodified pole-array heat sink

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Figure 10

Transient performance of the modified pole-array heat sink

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Figure 11

(a) Microchannel heat sink, thermal insulating block, and water manifold; (b) TO-220 part ready for clamping block and use

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Figure 12

Thermal resistance for microchannel and pole-array heat sink systems as a function of flow rate

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Figure 13

Experimental results for a 100mHz200W thermal load applied to the microchannel heat sink

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Figure 14

Simulation results for a 100mHz200W thermal load applied to the microchannel heat sink

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Figure 15

Transient performance of the microchannel heat sink

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