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RESEARCH PAPERS

Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling

[+] Author and Article Information
Z. A. Williams1

 Miltec Research and Technology, 9 Industrial Park, Oxford, MS 38655zwilliams@mil-tec.com

J. A. Roux

Mechanical Engineering,  University of Mississippi, MS 38677

1

Corresponding author.

J. Electron. Packag 129(4), 488-495 (Apr 19, 2007) (8 pages) doi:10.1115/1.2804100 History: Received January 18, 2007; Revised April 19, 2007

The increasing demand for smaller more compact electronic systems as well as the need to handle higher levels of power dissipation has lead to an increase in necessity for more innovative cooling designs. In recent years, computational fluid dynamics (CFD ) software has been used extensively in the design of thermal control systems for electronics. In many cases, there remains a need for experimental evaluation of cooling systems in order to validate the results of the CFD simulations. The present work investigates several variations of a liquid cooled base plate channel design for an array of generic power amplifier units. Several different channel insert configurations are investigated as miniheat exchangers using both copper fins and graphite foam. Experiments were conducted measuring the chip temperatures as well as the inlet liquid temperature. CFD simulations were also conducted to guide the experimental program. Effective heat transfer coefficients were also reverse-engineered using CFD software and the experimental results.

Copyright © 2007 by American Society of Mechanical Engineers
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References

Figures

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Figure 11

Water-only experimental results versus laminar and turbulent CFD predictions for 3.15×10−5m3∕s(0.50gpm), T∞=25°C

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Figure 12

Cooling as a function of foam type for the inline foam configuration, T∞=25°C

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Figure 13

Cooling as a function of foam type for the corrugated configuration, T∞=25°C

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Figure 14

Material comparison for zigzag configuration at a flow rate of 3.15×10−5m3∕s(0.50gpm), T∞=25°C

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Figure 1

Air cooling results from previous research (11)

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Figure 4

Graphite foam configurations

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Figure 5

Base plate with chip resistors

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Figure 6

Water-cooled base plate sketch

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Figure 7

Graphite foam configurations in cooling channel

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Figure 8

Stick with copper zigzag fins in cooling channel

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Figure 9

Water cooling flow circuit setup

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Figure 10

Water-only cooling as a function of flow rate T∞=25°C

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Figure 2

Water-cooled base plate (top) with substrates and chips

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Figure 3

ICEPAK ® sketch of water-cooled design

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Figure 15

Zigzag copper water experimental data versus CFD predictions for a flow rate of 3.15×10−5m3∕s(0.50gpm), T∞=25°C

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Figure 16

POCO foam comparison for all water configurations tested at 3.15×10−5m3∕s(0.50gpm), T∞=25°C

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Figure 17

POCO HTC foam comparison for all water configurations tested at 3.15×10−5m3∕s(0.50gpm), T∞=25°C

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Figure 18

Copper fin comparison for all water configurations tested at 3.15×10−5m3∕s(0.50gpm), T∞=25°C

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Figure 19

Overall comparison of all water configurations tested at 3.15×10−5m3∕s(0.50gpm), T∞=25°C

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