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RESEARCH PAPERS

High Thermal Conductive Si3N4 Particle Filled Epoxy Composites With a Novel Structure

[+] Author and Article Information
Hong He, Yanchun Han, Yuan Shen, Deliu Wang

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, Jiangsu 210016, P. R. C.

Renli Fu1

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, Jiangsu 210016, P. R. C.renlifu@nuaa.edu.cn

1

Corresponding author.

J. Electron. Packag 129(4), 469-472 (Apr 04, 2007) (4 pages) doi:10.1115/1.2804097 History: Received October 29, 2006; Revised April 04, 2007

Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si3N4 particle filled epoxy composite with a novel structure was fabricated by a processing method and structure design. Epoxy resin used in particle form was obtained by premixing and crushing. Different particle sizes were selected by sieving. High thermal conductivity was achieved at relative low volume fraction of the filler. The microstructure of the composites indicates that a continuous network is formed by the filler, which mainly completes the heat conduction. Thermal conductivity of the composites increases as the filler content increases, and the samples exhibit a highest thermal conductivity of 1.8WmK at 30% volume fraction of the filler in the composites using epoxy particles of 2mm. The composites show low dielectric constant and low dielectric loss.

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Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

Microstructure of the composites using 2mm polymer particles (SEM): (a) 5% Si3N4; (b) 10% Si3N4)

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Figure 2

Microstructure of the composites using 0.01mm polymer particles (SEM, 15% Si3N4): (a) low magnification, 300×; (b) high magnification, 1200×

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Figure 3

Microstructure of the composites using 2mm epoxy resin particles at the interface (SEM) (Si3N4 aggregates, interpenetrates, and combines with the polymer)

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Figure 4

Thermal conductivity of the Si3N4/epoxy composites as a function of the filler content

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Figure 5

Dielectric properties of the Si3N4/epoxy composites as a function of the filler content

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