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RESEARCH PAPERS

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

[+] Author and Article Information
Krishna Tunga, Suresh K. Sitaraman

Computer Aided Simulation for Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 129(4), 427-433 (Feb 13, 2007) (7 pages) doi:10.1115/1.2804091 History: Received September 20, 2006; Revised February 13, 2007

Although accelerated thermal cycling has been widely used in electronics industry to qualify electronic packages, efforts to reduce the time and cost associated with such qualification techniques are continuously being sought. This paper outlines a laser-moiré based experimental technique to quickly assess the thermal cycling reliability of microelectronic packages. Unlike accelerated thermal cycling that takes several months to complete, the proposed technique takes one to two weeks to complete and does not suffer from various modeling assumptions used in finite-element simulations. The developed technique has been used to determine the thermomechanical reliability of organic and ceramic ball grid array packages, and it is shown that the number of cycles determined by the proposed technique is comparable to the number of cycles determined through accelerated thermal cycling.

Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of moiré interferometry (12)

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Figure 2

Moiré interferometry experimental setup

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Figure 3

U null fringes at room temperature—plastic BGA

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Figure 4

V null fringes at room temperature—plastic BGA

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Figure 5

U field fringes at 0°C—plastic BGA

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Figure 6

V field fringes at 0°C—plastic BGA

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Figure 7

U field fringes at 100°C—plastic BGA

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Figure 8

V field fringes at 100°C—plastic BGA

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Figure 9

U null fringes at room temperature—ceramic BGA

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Figure 12

V field fringes at 0°C—ceramic BGA

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Figure 13

U field fringes at 100°C—ceramic BGA

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Figure 14

V field fringes at 100°C—ceramic BGA

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Figure 15

Results from the fatigue life estimation—PBGA package

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Figure 11

U field fringes at 0°C—ceramic BGA

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Figure 10

V null fringes at room temperature—ceramic BGA

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