0
RESEARCH PAPERS

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

[+] Author and Article Information
Samson Yoon

Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, MD 20740

Bongtae Han1

Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, MD 20740bthan@umd.edu

Zhaoyang Wang

Department of Mechanical Engineering, The Catholic University of America, Washington, DC 20064

To the best of authors' knowledge, only ABAQUS provides the general mass diffusion analysis capabilities, which can analyze multimaterial systems subjected to anisothermal loading conditions.

1

Corresponding author.

J. Electron. Packag 129(4), 421-426 (Apr 24, 2007) (6 pages) doi:10.1115/1.2804090 History: Received September 15, 2006; Revised April 24, 2007

Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) direct analogy and (2) normalized analogy. The schemes are implemented to define valid domains of application. The results corroborate that the direct analogy is valid only for single-material systems, but the normalized analogy can be extended to multimaterial systems if thermal loading conditions are isothermal, spatially as well as temporally.

FIGURES IN THIS ARTICLE
<>
Copyright © 2007 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 2

Moisture diffusion in a single-material specimen subjected to an isothermal loading condition. (a) t=1800s and (b) t=3600s.

Grahic Jump Location
Figure 3

Moisture diffusion in a bimaterial specimen subjected to an isothermal loading condition. (a) t=1800s and (b) t=3600s.

Grahic Jump Location
Figure 4

Moisture diffusion in a single-material specimen subjected to an anisothermal loading condition. (a) t=1800s and (b) t=3600s.

Grahic Jump Location
Figure 5

Moisture diffusion in a bimaterial specimen subjected to an anisothermal loading condition. (a) t=1800s and (b) t=3600s.

Grahic Jump Location
Figure 1

Material system used in the simulation

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In