Tian, G., Liu, Y., Lall, P., Johnson, W., and Suhling, J., 2003, “Drop Reliability of Corner Bonded CSP in Portable Products, ASME InterPACK Conference,” Maui, HI, Jul. 6–11.
Lall, P., Panchagade, D., Liu, Y., Johnson, W., and Suhling, J., 2004, “Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact,” "54th Electronic Components and Technology Conference", pp. 1296–1303.
Xie, D., Arra, M., Shangkai, D., Phan, H., Geiger, D., and Yi, S., 2002, “Life Prediction of Lead Free Solder Joints for Handheld Products,” "presented and published at Telecom Hardware Solutions Conference, Doubletree Hotel", Plano, TX, May 15–16.
Xie, D., Arra, M., Yi, S., and Rooney, D., 2003, “Solder Joint Behavior of Area Array Packages in Board Level Drop for Handheld Devices,” "Electronic Components & Technology Conference", pp. 130–135.
Wu, J., Song, G., Yeh, C.-p., and Wyatt, K., 1998, “Drop/Impact Simulation and Test Validation of Telecommunication Products,” "Intersociety Conference on Thermal Phenomena", pp. 330–336.
Wu, J., 2000, “Global and Local Coupling Analysis for Small Components in Drop Simulation,” "Sixth International LSDYNA Users Conference", pp. 11:17–11:26.
Irving, S., and Liu, Y., 2004, “Free Drop Test Simulation for Portable IC Package by Implicit Transient Dynamics FEM,” "54th Electronic Components and Technology Conference", pp. 1062–1066.
Pitaressi, J., Roggeman, B., and Chaparala, S., 2004, “Mechanical Shock Testing and Modeling of PC Motherboards,” "54th Electronics Compoents and Technology Conference", pp. 1047–1054.
Tee, T. Y., Ng, H. S., Lim, C. T., Pek, E., and Zhong, Z., 2003, “Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications,” "53rd Electronic Components and Technology Conference", pp. 121–129.
Wong, E. H., Lim, C. T., Field, J. E., Tan, V. B. C., Shim, V. P. M., Lim, K. T., and Seah, S. K. W., 2003, “Tackling the Drop Impact Reliability of Electronic Packaging,” "ASME International Electronic Packaging Technical Conference and Exhibition", Maui, Jul. 6–11, pp. 1–9.
Zhu, L., 2001, “Submodeling Technique for BGA Reliability Analysis of CSP Packaging Subjected to an Impact Loading,” "InterPACK Conference Proceedings".
Zhu, L., 2003, “Modeling Technique for Reliability Assessment of Portable Electronic Product Subjected to Drop Impact Loads,” "53rd Electronic Components and Technology Conference", pp. 100–104.
Zhu, L., and Marccinkiewicz, W., 2004, “Drop Impact Reliablity Analysis of CSP Packages at Board and Product System Levels Through Modeling Approaches,” "Inter Society Conference on Thermal and Thermo-Mechanical Phenomena", pp. 296–303.
Lim, C. T., and Low, Y. J., 2002, “Investigating the Drop Impact of Portable Electronic Products,” "Electronic Components & Technology Conference", pp. 1270–1274.
Lin, C.-C., 2002, “Finite-Element Analysis of a Computer Hard-Disk Drive Under Shock,” ASME J. Mech. Des.
[CrossRef], 124 , pp. 121–125.
Clech., J.-P., 1996, “Solder Reliability Solutions: A PC-Based Design-for-Reliability Tool,” "Proceedings of the Surface Mount International Conference", San Jose, CA, Sept. 8–12, Vol. I , pp. 136–151.
Clech., J.-P., 1998, “Flip-chip/CSP Assembly Reliability and Solder Volume Effects,” "Proceedings of the Surface Mount International Conference", San Jose, CA, Aug. 25–27, pp. 315–324.