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TECHNICAL BRIEF

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

[+] Author and Article Information
Tong Hong Wang

Central Labs, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Road, Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan

Yi-Shao Lai

Central Labs, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Road, Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwanyishao_lai@aseglobal.com

J. Electron. Packag 129(3), 366-370 (Sep 12, 2006) (5 pages) doi:10.1115/1.2753988 History: Received July 04, 2006; Revised September 12, 2006

Due to cost and process considerations, sometimes a drop-in heat spreader is incorporated in a quad flat package, which is not attached to the die pad. Consequently, due to mismatch of thermal expansions of the components, gapping is inevitable on the unattached interface between drop-in heat spreader and die pad during temperature change. The presence of the gap would potentially decrease the reliability and thermal performance of the package. In this paper, gap distributions on the unattached interface and thermal characteristics of a quad flat package implemented with an unattached drop-in heat spreader are examined through the thermal-mechanical coupling analysis. A numerical procedure is proposed to specify film coefficients as functions of gap openings on separated surfaces. Effects of mesh density and interfacial heat transfer conditions on the numerical solutions are then investigated.

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Copyright © 2007 by American Society of Mechanical Engineers
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References

Figures

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Figure 2

QFP with heat spreader

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Figure 3

Two-dimensional half-symmetry finite element model

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Figure 4

Time histories of junction temperature

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Figure 5

Gap distributions

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Figure 6

Heat flux across interface

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Figure 7

Temperature contours (°C)

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Figure 8

Time histories of junction temperature

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Figure 9

Heat flux across interface

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Figure 10

Gap distributions

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