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TECHNICAL PAPERS

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

[+] Author and Article Information
Yen-Shu Chen1

Department of Engineering and System Science,  National Tsing Hua University, Hsinchu 30013, Taiwan, Republic of Chinad903102@oz.nthu.edu.tw

Kuo-Hsiang Chien

Energy & Environment Research Laboratories,  Industrial Technology Research Institute, Hsinchu 310, Taiwan, Republic of Chinakhchien@itri.org.tw

Chi-Chuan Wang

Energy & Environment Research Laboratories,  Industrial Technology Research Institute, Hsinchu 310, Taiwan, Republic of Chinaccwang@itri.org.tw

Tzu-Chen Hung

Department of Mechanical and Automation Engineering,  I-Shou University, Kaohsiung County 840, Taiwan, Republic of Chinatchung@isu.edu.tw

Yuh-Ming Ferng

Nuclear Science and Technology Development Center,  National Tsing Hua University, Hsinchu 30013, Taiwan, Republic of Chinaymferng@mail.ess.nthu.edu.tw

Bau-Shei Pei

Department of Engineering and System Science,  National Tsing Hua University, Hsinchu 30013, Taiwan, Republic of China

1

Corresponding author.

J. Electron. Packag 129(3), 348-355 (Dec 19, 2006) (8 pages) doi:10.1115/1.2753970 History: Received August 28, 2006; Revised December 19, 2006

This study examines the spreading ability of rectangular plates numerically, analytically, and experimentally. The effect of aspect ratio, defined as an equivalent radius of a heater divided by that of a spreader plate, is investigated. The numerical results show a very good agreement with the analytical solutions. From the calculated results, the spreading resistance of the conduction plates with a small aspect ratio is higher than the one-dimensional conduction resistance. Calculated results also show that the spreading ability of a metal plate would be affected slightly by the external convective heat-transfer coefficient when the ratio of the longitudinal heat convection to the lateral heat spreading is less than 0.1. In addition to the numerical analysis, experimental comparisons between copper∕aluminum plates and a vapor chamber having the same thickness have been conducted. The experimental results show that the thermal resistance of the metal plates is independent of input power whereas that of the vapor chamber shows a noticeable drop with increased power. For the influence of concentrated heat source, the surface temperature distributions for the metal plates become concentrated with a reduced aspect ratio. However, the variations of the aspect ratio and the input power would yield minor effects to the surface temperature distribution of the vapor chamber. As compared with the conduction plates, the vapor chamber would offer a lower temperature rise and a more uniform temperature distribution. Thus, the vapor chamber provides a better choice as a heat spreader for concentrated heat sources.

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Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

The spreader plate with a central heat source

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Figure 2

The computation domain: (a) the schematic with the corresponding boundary conditions, and (b) the grid distribution

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Figure 3

The schematic of the inner structure of the vapor chamber used in this study

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Figure 4

The schematic of (a) the assembled heat sink and (b) and (c) the attached plate-fin heat sink

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Figure 5

Schematic of the wind tunnel

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Figure 6

The numerical results with different convective coefficients

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Figure 7

Spreading resistances of (a) the aluminum 6061 plate and (b) the copper plate

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Figure 8

The numerical results and those calculated by the correlation (Ref. 3): (a) the aluminum 6061 plate, and (b) the copper plate

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Figure 9

The experimental results with the aspect ratio of 0.256: (a) the temperature difference across the spreaders, and (b) the corresponding thermal resistances

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Figure 10

The temperature distribution across the spreader while the aspect ratio=0.256: (a) the rmss, and (b) the maximum difference of the top surface temperature

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Figure 11

The temperature distributions across the spreaders with the input power of 50W: (a) The rmss, and (b) the maximum difference of the top surface temperature

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