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RESEARCH PAPERS

Air Cooling of Variable Array of Heated Modules in a Vertical Channel

[+] Author and Article Information
Vipin Yadav

Department of Mechanical Engineering, The University of Auckland, Auckland, New Zealand 1142v.yadav@auckland.ac.nz

Keshav Kant1

Department of Mechanical Engineering, Indian Institute of Technology, Kanpur, India 208 016keshav@iitk.ac.in

1

Corresponding author.

J. Electron. Packag 129(2), 205-215 (Jul 23, 2006) (11 pages) doi:10.1115/1.2721594 History: Received June 02, 2006; Revised July 23, 2006

The effect of array size and substrate thermal conditions upon heat transfer characteristics of an array of heated modules subjected to buoyancy assisted convection cooling in air is investigated. The comparative analysis of numerical and experimental data for multimodular array of heated modules mounted on a printed circuit board (PCB) forming one of the walls of a vertical channel is presented. Numerical investigation involved turbulent flow analysis based on a realizable kε model. Experimental efforts involved development of a test rig and use of state-of-the-art data acquisition system for simulating the heat transfer phenomenon from the module surfaces under various test conditions. Moderate to high flow velocities in the channel and the heat flux values near those occurring in electronic cooling applications using air as coolant are considered. Initially, the data for mean Nusselt number occurring at various rows in the array under consideration are presented, and in order to validate the numerical model, variation pattern and deviation between numerical and experimental results are analyzed keeping the substrate (PCB) as the insulated surface. The same numerical model was extended to study the cases of varying substrate thermal conditions. An empirical relation is proposed for evaluating Nu under different substrate thermal conditions for array geometries considered and flow rates within the parametric ranges discussed.

Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

Computational domains for: (a) one module case; and (b) multimodule case

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Figure 2

Schematics of the experimental setup

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Figure 3

Details of array of modules at the PCB surface

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Figure 4

Dependence of correction factor on surface temperature

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Figure 5

Comparison of results with the data from previous works

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Figure 6

The effect of flow and thermal conditions upon the nature of convection regime

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Figure 7

Comparison of Nusselt number based on experimental and numerical data for single module

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Figure 8

Comparison of Nusselt number based on experimental and numerical data for two rows with Δθr=ξr=1

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Figure 9

Relative deviation in Nusselt number for first and second rows with Δθr=ξr=1

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Figure 10

Relative deviation in Nusselt number for three rows case for Δθr=ξr=1

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Figure 11

Relative deviation in Nusselt number for five rows case

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Figure 12

Relative deviation in Nusselt number for different Δθr and ξr

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Figure 13

Relative deviation in average Nusselt number for different Δτr when ξr=1.00

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Figure 14

Relative deviation in average Nusselt number for different Δτr when ξr=0.50

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Figure 15

Relative deviation in average Nusselt number for different Δτr when ξr=0.33

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Figure 16

Comparison of predictions from empirical relation with the data in the literature

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