0
RESEARCH PAPERS

A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

[+] Author and Article Information
T. Zhang, K. K. Choi

Department of Mechanical & Industrial Engineering, The University of Iowa, Iowa City, IA 52242

S. Rahman

Department of Mechanical & Industrial Engineering, The University of Iowa, Iowa City, IA 52242rahman@engineering.uiowa.edu

K. Cho, P. Baker, M. Shakil, D. Heitkamp

 Rockwell Collins, Inc., Cedar Rapids, IA 52498

J. Electron. Packag 129(2), 179-189 (Jul 05, 2006) (11 pages) doi:10.1115/1.2721092 History: Received February 09, 2006; Revised July 05, 2006

This paper presents a global–local methodology for predicting mechanical deformation and fatigue durability of solder joints in electronic packaging systems subject to cyclic thermal loading. It involves a global deformation analysis, a local critical solder–joint analysis, and a fatigue life analysis. The global deformation analysis includes a new optimization formulation for determining an equivalent model. The methodology developed was applied to fine pitch ball grid array (fpBGA) and super ball grid array (SBGA) packages. Selective experimental efforts were also undertaken to evaluate the predicted deformation characteristics of the fpBGA package. A good agreement was obtained between the simulated deformation results and experimental observations. For the durability analysis, the total fatigue life predicted using the energy-based method is larger than 2500 cycles—a trend observed experimentally for both packages entailing widely different designs. Based on proposed modeling and simulation results and package designs studied, the SBGA package is more durable than the fpBGA package.

Copyright © 2007 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 2

Various possible shapes of equivalent model for solder joint: (a) brick; (b) diamond; (c) general (e.g., eight-parameter model)

Grahic Jump Location
Figure 3

Flowchart for calculating equivalent model parameters

Grahic Jump Location
Figure 4

The fpBGA package (all dimensions are in mm)

Grahic Jump Location
Figure 5

The SBGA package (all dimensions are in mm)

Grahic Jump Location
Figure 6

Thermal load cycles

Grahic Jump Location
Figure 7

Global and local models: (a) fpBGA; and (b) SBGA

Grahic Jump Location
Figure 8

Reaction force histories for fpBGA: (a) proposed equivalent model; (b) actual solder joint; and (c) volume-averaged equivalent model

Grahic Jump Location
Figure 9

Reaction force histories for SBGA: (a) proposed equivalent model; (b) actual solder joint; and (c) volume-averaged equivalent model

Grahic Jump Location
Figure 10

In-plane x displacement of fpBGA package: (a) setup; (b) simulation; and (c) experiment (fitted)

Grahic Jump Location
Figure 11

Out-of-plane displacement of fpBGA package (1 fringe=9.24μm)

Grahic Jump Location
Figure 12

Relative out-of-plane displacement of fpBGA package

Grahic Jump Location
Figure 13

Out-of-plane displacement of fpBGA package–PCB assembly: (a) setup; and (b) relative displacement

Grahic Jump Location
Figure 14

Contour plots of predicted crack-initiation life: (a) fpBGA; and (b) SBGA

Grahic Jump Location
Figure 15

Verification of the tie option: (a) simple test problem; (b) compatible mesh without tie option; and (c) incompatible mesh with tie option

Grahic Jump Location
Figure 1

A schematic of the global–local methodology: (a) global model; and (b) local model

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In