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RESEARCH PAPERS

Design Guideline for Ball Impact Test Apparatus

[+] Author and Article Information
Chang-Lin Yeh

Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc. 26 Chin 3rd Road, Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan

Yi-Shao Lai1

Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc. 26 Chin 3rd Road, Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwanyishao_lai@aseglobal.com

1

Corresponding author.

J. Electron. Packag 129(1), 98-104 (Apr 18, 2006) (7 pages) doi:10.1115/1.2429716 History: Received January 04, 2006; Revised April 18, 2006

The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles, the ball impact test process is analyzed to provide insights into transient characteristics of this particular test methodology. A design guideline for the ball impact test apparatus based on characteristics of the measured impact force profile is proposed.

Copyright © 2007 by American Society of Mechanical Engineers
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References

Figures

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Figure 7

Impact force profiles for τi=500μs

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Figure 8

Amplification factor of Fmax

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Figure 2

Load cell placed on target side

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Figure 3

Load cell attached to pin

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Figure 4

Simplified SDOF structural system

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Figure 5

Impact force profiles for τi=30μs

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Figure 6

Impact force profiles for τi=100μs

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Figure 1

Typical measured impact force profile

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Figure 9

Ratio of Fmin∕Fo,max

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Figure 10

Amplification factor of τr

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Figure 11

Amplification factor of Ar

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Figure 12

Amplification factor of Sr

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Figure 13

Estimated measurement errors for ξ=0

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Figure 14

Estimated measurement errors for ξ=0.05

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Figure 15

Estimated measurement errors for ξ=0.2

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Figure 16

Estimated measurement errors for ξ=0.5

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