0
RESEARCH PAPERS

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

[+] Author and Article Information
Hai Bo Fan1

Department of Mechanical Engineering,  Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kongmehaibo@ust.hk

Edward K. L. Chan, Cell K. Y. Wong, Matthew M. F. Yuen

Department of Mechanical Engineering,  Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

1

Corresponding author.

J. Electron. Packag 129(1), 35-40 (Mar 14, 2006) (6 pages) doi:10.1115/1.2429707 History: Received July 26, 2005; Revised March 14, 2006

Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important to develop a better understanding of the reliability at a molecular level. In this paper, molecular dynamics (MD) simulations were conducted to investigate the interfacial energy of the epoxy molding compound (EMC) cuprous oxide system during the thermal cycling test. In order to investigate the effect of the cuprous oxide content in the copper substrate on the interfacial adhesion, two kinds of MD models were examined in this study. The results revealed that the cuprous oxide content in the copper substrate had a large effect on the interfacial adhesion between the EMC and copper, which is consistent with the experimental observation.

FIGURES IN THIS ARTICLE
<>
Copyright © 2007 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

Reaction of a curing agent with four epoxy resins

Grahic Jump Location
Figure 2

Molecular model of a fragment of the EMC after the conformation

Grahic Jump Location
Figure 3

MD model of the EMC and cuprous oxide system

Grahic Jump Location
Figure 4

Cuprous oxide content against thermal cycles

Grahic Jump Location
Figure 5

A thermal cycling test profile

Grahic Jump Location
Figure 6

Schematic drawing of the bi-material system deformation during (a) the heating step and (b) the cooling step

Grahic Jump Location
Figure 7

Snapshots of the system after (a) 0 thermal cycle, (b) 600 thermal cycles, (c) 1200 thermal cycles, and (d) 1800 thermal cycles from the MD simulations

Grahic Jump Location
Figure 8

Interfacial bonding energy against thermal cycles

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In