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RESEARCH PAPERS

Design Optimization and Reliability of PWB Level Electronic Package

[+] Author and Article Information
Mohammad Masum Hossain

Mechanical and Aerospace Engineering Department, Electronics, MEMS and Nano Systems Packaging Center, The University of Texas at Arlington, Arlington, TX 76010masumh@uta.edu

Sudhakar G. Jagarkal

Mechanical and Aerospace Engineering Department, Electronics, MEMS and Nano Systems Packaging Center, The University of Texas at Arlington, Arlington, TX 76010

Dereje Agonafer

Mechanical and Aerospace Engineering Department, Electronics, MEMS and Nano Systems Packaging Center, The University of Texas at Arlington, Arlington, TX 76010agonafer@uta.edu

Menberu Lulu

Gordon Institute of Business Science, University of Pretoria, South Africamenberu.lulu@gmail.com

Stefan Reh

 ANSYS Inc., 275 Technology Drive, Canonsburg, PAstefan.reh@ansys.com

J. Electron. Packag 129(1), 9-18 (Sep 21, 2006) (10 pages) doi:10.1115/1.2429704 History: Received October 23, 2004; Revised September 21, 2006

As the electronic packaging industry develops technologies for fabrication of smaller, faster, economical and reliable products, thermal management and design play an important role. Temperature fluctuations caused by either power consumption or environmental changes, along with the resulting thermal expansion mismatch between the various packages materials result in deformation stresses in packages/assemblies especially in solder interconnects. Increased power dissipation and density in modern electronics system requires efficient and intelligent design and thermal management strategies to ensure the reliability of electronic products. In the past reliability issues related to optimization of electronic packages were dealt with by coupling analysis tools with optimization solvers. In this paper, ANSYS APDL code is used with a built-in optimization tool for optimization of electronic packages, and for improving the solder joint life and arriving at optimal design. It has been shown that, design optimization would enormously decrease the lead time. The finite element tool ANSYS is used to estimate the cycles to fatigue failure of solder joint of the package coupled with optimization module present in the solver for providing the details on determining optimal design parameters that affect the product reliability. Four model characteristics: printed wiring board (PWB) core in-plane Young’s modulus, PWB core in-plane coefficient of thermal expansion, PWB core thickness, and the standoff solder joint height are chosen as the optimization inputs (design variables) that ensure higher reliability and improved performance of the assembled product. The objective junction of the paper is to minimize average plastic work to improve the fatigue life of solder joints of the package. Subapproximation, design of experiment and central composite design based response surface modeling methodologies are used to study the effects of each design variables on the fatigue life.

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Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

Design optimization procedure

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Figure 2

State variable as a function of design variables (10)

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Figure 3

Design optimization flow using CCD based RS

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Figure 4

Flowchart for the finite element modeling (8)

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Figure 5

Package outline drawing

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Figure 6

Nonlinear quarter model

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Figure 7

Thermal cycle profile used for analysis

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Figure 8

Plastic work done

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Figure 9

Effect of design variable on average delta plastic work

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Figure 10

Solder joint failure life as a function of design variables

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Figure 11

Sensitivity plot for the SFAIL

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