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RESEARCH PAPERS

Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module

[+] Author and Article Information
Y. Pang, E. Scott

Department of Mechanical Engineering, Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061

J. D. van Wyk, Z. Liang

The Bradley Department of Electrical Engineering, Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061

CoolMOS is a trademark of Infineon Technologies.

I-DEAS is a trademark of Electronic Data System Corporation.

ALOX is a trademark of Micro Components Ltd.

Thermal Clad is a trademark of The Bergquist Company.

IMS is a trademark of Sanyo Electric Co., Ltd.

J. Electron. Packag 129(1), 1-8 (Apr 16, 2006) (8 pages) doi:10.1115/1.2429703 History: Received August 31, 2004; Revised April 16, 2006

The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.

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Copyright © 2007 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Exploded view of active IPEM

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Figure 2

Cross sectional view around any device in the active IPEM (not to scale)

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Figure 3

Schematic of ALOX™ substrate

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Figure 4

Illustration of double-sided cooling for active IPEM

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Figure 5

Schematic of Thermal Clad™ substrate

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Figure 6

Top and bottom boundary conditions on the studies of double-sided cooling

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Figure 7

Temperature distribution for models I–III

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Figure 8

Temperature rise for each heat source for models I–III

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Figure 9

Results comparison for different ceramic materials

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Figure 10

Results comparison for double-sided cooling of models VII–X

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Figure 11

Temperature rise of the heat sources at different range of heat transfer coefficient

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Figure 12

Comparison of temperature rise of heat sources for models VI and XI–XIII (significance of polyimide thickness)

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Figure 13

Comparison of the effect of the best combined studied parameters

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Figure 14

Dimensionless sensitivity coefficient for each input parameter in the numerical model

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