Singulation of Electronic Packages With Abrasive Waterjets

[+] Author and Article Information
Mohamed Hashish

 Flow International Corporation, Kent, WAmhashish@flowcorp.com

J. Electron. Packag 128(4), 479-483 (Feb 09, 2006) (5 pages) doi:10.1115/1.2353328 History: Received September 01, 2005; Revised February 09, 2006

Abrasive waterjets (AWJ) were used for the first time to commercially singulate electronic chips such as those used for flash memory cards found in digital cameras, cell phones, and universal serial bus (USB) storage devices. Cutting these components requires high cutting speed, high edge quality, accuracy, and precision. For example, a minimal accuracy needed is 0.1mm and a minimum Cpk of 1.33. A relatively small AWJ (0.38mm) was successfully used to accurately cut chips at speeds of 2060mms. It was determined that the use of machine vision is critical to meeting the accuracy requirements. The cutting process consisted of piercing starting holes and then cutting shaped pattern cuts to contour the chip components. Drilling holes was performed without delamination, and the cutting speed was optimized to meet the intricate chip geometry. Because of the relatively high volume of components to be cut, requiring around-the-clock duty, process and machine reliability are of critical importance. This paper discusses the results and observation of the cutting process as well as the performance of the system.

Copyright © 2006 by American Society of Mechanical Engineers
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Figure 1

Strip configurations containing 11×15mm components

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Figure 2

Areas to be cut by AWJ and saw

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Figure 3

Cutout produced after AWJ cutting

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Figure 4

Special AWJ nozzles for singulation applications

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Figure 5

AWJ machine features

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Figure 6

AWJ nozzle and strips on a tray

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Figure 7

Cut inspection and AWJ-cut strip

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Figure 8

Effect of abrasive flow rate on mold side (exit) cut quality

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Figure 9

Effect of speed on surface finish (waviness)

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Figure 10

Burr-free cutting of PCB

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Figure 11

Kerf width at 50mm∕s (top) and 150mm∕s (bottom)

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Figure 12

Kerf width and mixing tube diameter variation




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