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RESEARCH PAPERS

Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers

[+] Author and Article Information
Z. A. Williams1

 Miltec Research and Technology, Oxford Enterprise Center & Industrial Park, Oxford, MS 38655zwilliams@miltecresearch.com

J. A. Roux

 University of Mississippi, Department of Mechanical Engineering, University, MS 38677

1

Corresponding author.

J. Electron. Packag 128(4), 456-465 (Dec 23, 2005) (10 pages) doi:10.1115/1.2353282 History: Received October 14, 2005; Revised December 23, 2005

Much focus has been placed on the thermal management of electronics in recent years. An overall reduction in size of electronic components as well as advances in chip technology, leading to ever higher power dissipation, have increased the necessity for innovative cooling designs. While computational fluid dynamics (CFD) software packages have been instrumental in the design of cooling systems, it remains important to validate these CFD predictions through experimentation. The present work focuses on the experimental evaluation of several variations of an air cooled base plate channel design for an array of generic power amplifier modules. In the current study two materials, graphite foam and a microfibrous material, are investigated as mini-heat exchangers to be implemented in the cooling channel of the base plate. Computational simulations have been conducted on some of the proposed designs in order to evaluate certain parameters. Experiments were conducted measuring chip temperatures and the pressure drop across the cooling channel. Effective heat transfer coefficients were also reverse engineered.

Copyright © 2006 by American Society of Mechanical Engineers
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References

Figures

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Figure 2

IcePak sketch of air cooled design

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Figure 3

Sketch of base plate (bottom) with heat transfer enhancing material

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Figure 4

Graphite foam configurations

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Figure 5

Base plate with chip resistors

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Figure 6

Air cooled base plate

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Figure 7

Graphite foam configurations in cooling channel

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Figure 8

Stick with microfibrous material in cooling channel

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Figure 9

Cabinet with stick

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Figure 10

Comparison of air-only cooling data with IcePak predictions for base plate with inserts

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Figure 11

Cooling configuration comparison for HTC foam, copper bottom, 25°C ambient, 0.002m3∕s(4.2cfm)

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Figure 12

Cooling configuration comparison for POCO foam, copper bottom, 25°C ambient, 0.002m3∕s(4.2cfm)

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Figure 13

Cooling configuration comparison for HTC foam, copper bottom, 25°C ambient, 0.004m3∕s(8.3cfm)

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Figure 14

Cooling configuration comparison for POCO foam, copper bottom, 25°C ambient, 0.004m3∕s(8.3cfm)

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Figure 15

Cooling configuration comparison for HTC and POCO foams, copper bottom, 25°C ambient, 0.002m3∕s(4.2cfm)

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Figure 16

Cooling configuration comparison for HTC and POCO foams, copper bottom, 25°C ambient, 0.004m3∕s(8.3cfm)

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Figure 17

Flow rate impact for zigzag POCO foam with copper bottom (25°C ambient)

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Figure 18

Flow rate impact for POCO foam

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Figure 19

Flow rate impact for POCO foam at various heat dissipations

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Figure 20

Effective convective heat transfer coefficient versus flow rate

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Figure 1

Air cooled base plate (top) with substrates and chips

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