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RESEARCH PAPERS

Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology

[+] Author and Article Information
Wen-Hwa Chen1

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30043, Republic of Chinawhchen@pme.nthu.edu.tw

Shu-Ru Lin, Kuo-Ning Chiang

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30043, Republic of China

1

Corresponding author.

J. Electron. Packag 128(4), 331-338 (Sep 29, 2005) (8 pages) doi:10.1115/1.2229216 History: Received December 29, 2004; Revised September 29, 2005

An accurate and efficient analytical geometric method is presented for predicting the geometric parameters of the controlled collapse chip connection type solder joint using direct chip attach technology after a reflow process. By this method, the meridian of the solder joint is first discretized as a series of sufficiently fine fragmental arcs. After calculating the internal pressure inside the molten eutectic solder from the forces balance, the meridional and circumferential radii of curvature of each arc are then obtained from the Laplace-Young equation. As a result, the coordinates of each node of the arc and the solder joint geometry can be determined in turn. The factors that affect the final shape of the molten eutectic solder joints, including the solder volumes, external loading, pad size, surface tension of molten eutectic solder, and interfacial surface tension between the molten eutectic solder and the solid high-lead bump are considered herein. The results computed by the analytical geometric method are also compared with those obtained using the Surface Evolver program, the extended Heinrich’s model, and the experimental results. The results of the various approaches are mutually consistent.

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Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 10

Comparison of the solder joint geometric parameters with different ratios Vh∕(Ve+Vh)

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Figure 11

The solder joint with different ratios Vh∕(Ve+Vh)

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Figure 1

Geometric parameters of C4 type solder joint

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Figure 2

Forces balance for high-lead bump

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Figure 3

Analytical geometric model

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Figure 4

The facets discretization of Surface Evolver model

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Figure 5

The cross section of the specimen

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Figure 6

Comparison of the solder joint geometric parameters with different surface tensions γl

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Figure 7

Comparison of the solder joint geometric parameters with different external loadings

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Figure 8

Comparison of the solder joint geometric parameters with different radii of lower pad

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Figure 9

Comparison of the solder joint geometric parameters with different volumes of molten eutectic solder joint

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